Interfacial Reactions of Cu and In for Low-Temperature Processes

Wang, Y.W.; Kao, C. R.

doi:10.1109/eptc47984.2019.9026712

Cited by 3 publications

(1 citation statement)

References 14 publications

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“…Ga + focused ion beam (FIB) tools have been applied with some success to the preparation of cross-sections of low melting point metals (Tu & Zeng, 2002;Deppisch et al, 2006;Cheng et al, 2009;Tian et al, 2009aTian et al, , 2014Dang et al, 2012;Matsushima et al, 2013;Chou & Williams, 2014;de Morais et al, 2014;Soussan et al, 2015;Wang & Kao, 2019). There have not been any reports of the use of Xe + plasma focused ion beam (PFIB) applications to low melting point metal sample preparation.…”

Section: Introductionmentioning

confidence: 99%

Focused Ion Beam Preparation of Low Melting Point Metals: Lessons Learned From Indium

et al. 2022

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Indium (In) and other low melting point metals are used as interconnects in a variety of hybridized circuits and a full understanding of the metallurgy of these interconnects is important to the reliability and performance of the devices. This paper shows that room temperature focused ion beam (FIB) preparation of cross-sections, using Ga+ or Xe+ can result in artifacts that obscure the true In microbump structure. The use of modified milling strategies to minimize the increased local sample temperature are shown to produce cross-sections that are representative of the In bump microstructure in some sample configurations. Furthermore, cooling of the sample to cryogenic temperatures is shown to reliably eliminate artifacts in FIB prepared cross-sections of In bumps allowing the true bump microstructure to be observed.

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Section: Introductionmentioning

confidence: 99%

Focused Ion Beam Preparation of Low Melting Point Metals: Lessons Learned From Indium

et al. 2022

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Solid-State Growth Kinetics of Compound Layers in Electroplated Cu-In Layer Systems

Bickel,

Panchenko,

Junghähnel

2024

2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)

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Research Progress on the Solder Joint Reliability of Electronics Using in Deep Space Exploration

Guan

Chen

et al. 2023

Chin. J. Mech. Eng.

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The spacecraft for deep space exploration missions will face extreme environments, including cryogenic temperature, intense radiation, wide-range temperature variations and even the combination of conditions mentioned above. Harsh environments will lead to solder joints degradation or even failure, resulting in damage to onboard electronics. The research activities on high reliability solder joints using in extreme environments can not only reduce the use of onboard protection devices, but effectively improve the overall reliability of spacecraft, which is of great significance to the aviation industry. In this paper, we review the reliability research on SnPb solder alloys, Sn-based lead-free solder alloys and In-based solder alloys in extreme environments, and try to provide some suggestions for the follow-up studies, which focus on solder joint reliability under extreme environments.

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Interfacial Reactions of Cu and In for Low-Temperature Processes

Cited by 3 publications

References 14 publications

Focused Ion Beam Preparation of Low Melting Point Metals: Lessons Learned From Indium

Focused Ion Beam Preparation of Low Melting Point Metals: Lessons Learned From Indium

Solid-State Growth Kinetics of Compound Layers in Electroplated Cu-In Layer Systems

Research Progress on the Solder Joint Reliability of Electronics Using in Deep Space Exploration

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