2019
DOI: 10.1016/j.msea.2019.138096
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Intermetallics evolution and fracture behavior of Nb interlayer inserted Si3N4/Ti joints brazed with AgCuTi filler

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Cited by 31 publications
(4 citation statements)
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“…Xing et al [25] concluded that the Nb foil addition could effectively relax the residual stress of the graphite/Cu joint by its plastic deformation. Ong et al [26] presented that the Nb interlayer with good ductility could alleviate the residual thermal stress of the Si 3 N 4 /Ti joint using Ag-Cu-Ti + Nb filler. Therefore, the Nb foil application in graphite/Mo joining may contribute to the joint residual stress relief and thus giving rise to the joint strength improvement.…”
Section: Mechanical Characterisationsmentioning
confidence: 99%
“…Xing et al [25] concluded that the Nb foil addition could effectively relax the residual stress of the graphite/Cu joint by its plastic deformation. Ong et al [26] presented that the Nb interlayer with good ductility could alleviate the residual thermal stress of the Si 3 N 4 /Ti joint using Ag-Cu-Ti + Nb filler. Therefore, the Nb foil application in graphite/Mo joining may contribute to the joint residual stress relief and thus giving rise to the joint strength improvement.…”
Section: Mechanical Characterisationsmentioning
confidence: 99%
“…Ong et al pointed out that ductile Nb interlayer can lessen the residual stress of Si 3 N 4 /Ti joint. [43] Meanwhile, it can reduce Ti-based intermetallics' formation by inhibiting Ti diffusion into Si 3 N 4 substrate. As shown by Oliveira et al, Nb interlayer worked as a diffusion barrier to hinder brittle intermetallics formation in NiTi/TC4 joining.…”
Section: Mechanical Characterizationmentioning
confidence: 99%
“…G. Song et al [23] successfully brazed TiAl based alloy and Si 3 N 4 ceramics with AgCuTi filler, and the maximum shear strength reached 115 MPa. Compared with the traditional AgCu filler, the active filler AgCuTi has good ductility and wettability [24][25][26], which makes the Si 3 N 4 ceramic and alloy form a good structure. In view of this, this paper uses AgCuTi filler to connect TiZrHfNbMo high-entropy alloy and Si 3 N 4 ceramic, in order to solve the two main problems of poor wettability and large residual stress.…”
Section: Of 12mentioning
confidence: 99%