Joining of graphite to Ti6Al4V (TC4) alloy is achieved with three Cu-based fillers (Cu-22TiH 2 , Cu-50TiH 2 , and Cu-30TiH 2 -5Ni). Microstructural characterizations reveal that a thin TiC layer and a diffusion layer containing Ti solid solution (Ti(ss)) with Ti 2 Cu are developed at the graphite/filler layer and filler layer/TC4 interfaces, respectively. For the joint obtained with Cu-22TiH 2 filler, the filler layer consists of TiCu and Ti 2 Cu, whereas it is composed of Ti 2 Cu, TiCu, and Ti(ss) for the joint with Cu-50TiH 2 filler. In the case of the joint with Cu-30TiH 2 -5Ni filler, the filler layer mainly contains Ti(Cu,Ni) and Ti 2 (Cu,Ni). The microhardness of the interfacial area in the joints is highly related to the microstructure of joints. The filler layer of the joint with Cu-50TiH 2 filler exhibits higher microhardness than those with Cu-22TiH 2 and Cu-30TiH 2 -5Ni fillers, owing to the high content of Ti 2 Cu phase with relatively high microhardness and the increase in hardness of Ti-Cu intermetallics at higher brazing temperatures. The high shear strength of joints reveals favorable bonding of Cu-based fillers with substrates.
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