Interlayer Material Design Reducing Transient Liquid Phase Bonding Time

Sohn, Sunghyun; Moon, Byungrok; Lee, Junghoon; Kang, Ning; Moon, Young Hoon

doi:10.1007/s13391-019-00191-2

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Design Of Metallization-added Interlayer1

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2020

2024

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Cited by 5 publications

(2 citation statements)

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“…Sohn et al 35) used pure-Sn, Sn-3Cu, and Sn-10Cu alloys for the TLPB interlayer in Cu/interlayer/Cu structure. If Cu was added more than 0.7 wt% in Sn-Cu binary system, primary Cu 6 Sn 5 was formed.…”

Section: Design Of Metallization-added Interlayermentioning

confidence: 99%

See 1 more Smart Citation

Strategies to Reduce Transient Liquid Phase Bonding Time for the Die Attach of Power Semiconductors

Sohn

Kim

et al. 2020

Journal of Welding and Joining

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Section: Design Of Metallization-added Interlayermentioning

confidence: 99%

“…SEM micrographs of interfaces using various particle-introduced interlayers: (a, c) Cu/Sn58Bi/ Cu; (b, d) Cu/Sn58Bi-0.5CuZnAl/Cu. The bonding process was conducted at 250 ℃ for (a, b) 1 h and (c, d) 72 h34) Microstructure of TLPB for 1, 2, and 4 h using various interlayers: (a) Sn; (b) Sn-10Cu35) Journal of Welding and Joining, Vol. 38, No.…”

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confidence: 99%