Interfacial template-engineered eco-friendly nanocomposites towards rapid thermal conduction

Yan, Junbao; Zheng, Yong; Wang, Xunyi; Xiong, Junlong; Gui, Tao; Xu, Jun; Wang, Xiangxiao; Jia, Yingbin; Xiong, Siwei

doi:10.1016/j.coco.2022.101310

Cited by 6 publications

(2 citation statements)

References 18 publications

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“…Hence, reversible crosslinked polymer can crosslink and de‐crosslink through its reversible crosslink reaction and can be self‐healed, processed repeatedly, and degradable. [ 24–26 ] More importantly, the result of our work shows no sacrifice of the thermal conductivity of the reprocessed TIMs compared with the original sample, the reprocessability of TIMs will improve their utilization and broaden application fields.…”

Section: Introductionmentioning

confidence: 78%

Multiway Softness Polyurethane Elastomeric Composite with Enhanced Thermal Conductivity and Application as Thermal Interface Materials

Zhou

Wang

Shi

et al. 2023

Adv Materials Technologies

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The ever‐increasing computing power in modern electronics comes with significant heat waste that can't be ignored. For microchips to dissipate heat efficiently, thermal interface materials (TIMs) are the most critical components in semiconductor packaging. Soft elastomer composites are often used as TIMs due to their large‐strain reversible deformability with a small external force. For TIMs to cushion between the microchip and heat spreader, they must have high thermal conductivity and temperature‐tunable softness to reduce thermal resistance and relieve the warpage failure caused by thermal stress. However, thermal conductivity and softness are interrelated and restrict each other. To address this challenge, a radical strategy of introducing dynamic covalent bonds in the polyurethane/aluminum composite is used. The reversible and low energy of dynamic imine bonds along with the lengthening of the Khun segment in the crosslinking network imbues the material with temperature‐tunable softness function while maintaining high thermal conductivity. The resulting polyurethane elastomer (PUE) composite exhibits remarkable thermal conductivity (6.90 W m−1 K−1), low thermal resistance (0.13 K cm2 W−1), and excellent softness (elastic modulus 759.50 kPa, and stretchability 140.30%). This work provides a practical method to design thermally conductive and temperature‐tunable soft elastomer composites as TIMs in semiconductor packaging.

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Section: Introductionmentioning

confidence: 78%

Multiway Softness Polyurethane Elastomeric Composite with Enhanced Thermal Conductivity and Application as Thermal Interface Materials

Zhou

Wang

Shi

et al. 2023

Adv Materials Technologies

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show abstract

“…With the rapidly developing miniaturization and integration of mobile communication, new energy vehicles, smart devices, ultrahigh-voltage transmission equipment, and high-power light-emitting diodes (LEDs), the ensuing significant rise in thermal flux density poses a serious challenge to the stability and reliability of devices and components. , Thermally conductive polymer composites (TCPCs) are extensively used to enhance the heat transfer efficiency between heating devices and external components or radiators . These composites play a crucial role in ensuring effective heat dissipation and the long-term stable operation of equipment and components. − TCPCs retain the characteristics of polymers, such as lightness and ease of processing, as well as improve the low thermal conductivity of polymers, by introducing fillers with high thermal conductivity. − …”

Section: Introductionmentioning

confidence: 99%

Rapid Thermochromic and Highly Thermally Conductive Nanocomposite Based on Silicone Rubber for Temperature Visualization Thermal Management in Electronic Devices

Yan,

Cai,

Zhang

et al. 2024

ACS Appl. Mater. Interfaces

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Effective heat dissipation and real-time temperature monitoring are crucial for ensuring the long-term stable operation of modern, high-performance electronic products. This study proposes a silicon rubber polydimethylsiloxane (PDMS)-based nanocomposite with a rapid thermal response and high thermal conductivity. This nanocomposite enables both rapid heat dissipation and real-time temperature monitoring for high-performance electronic products. The reported material primarily consists of a thermally conductive layer (Al 2 O 3 /PDMS composites) and a reversible thermochromic layer (organic thermochromic material, graphene oxide, and PDMS nanocoating; OTM-GO/PDMS). The thermal conductivity of OTM-GO/Al 2 O 3 /PDMS nanocomposites reached 4.14 W m −1 K −1 , reflecting an increase of 2200% relative to that of pure PDMS. When the operating temperature reached 35, 45, and 65 °C, the surface of OTM-GO/Al 2 O 3 /PDMS nanocomposites turned green, yellow, and red, respectively, and the thermal response time was only 30 s. The OTM-GO/Al 2 O 3 /PDMS nanocomposites also exhibited outstanding repeatability and maintained excellent color stability over 20 repeated applications.

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Design of sandwich-structured para-aramid paper with polyphenylene sulfide non-woven fabric for enhancing mechanical properties and breakdown strength

Yao

Liu

Pei

et al. 2023

Composites Communications

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Interfacial template-engineered eco-friendly nanocomposites towards rapid thermal conduction

Cited by 6 publications

References 18 publications

Multiway Softness Polyurethane Elastomeric Composite with Enhanced Thermal Conductivity and Application as Thermal Interface Materials

Multiway Softness Polyurethane Elastomeric Composite with Enhanced Thermal Conductivity and Application as Thermal Interface Materials

Rapid Thermochromic and Highly Thermally Conductive Nanocomposite Based on Silicone Rubber for Temperature Visualization Thermal Management in Electronic Devices

Design of sandwich-structured para-aramid paper with polyphenylene sulfide non-woven fabric for enhancing mechanical properties and breakdown strength

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