Interfacial reactions in the Sn–Sb/Ag and Sn–Sb/Cu couples

Chen, Sinn Wen; Zi, An Ren; Chen, Po Yin; Wu, Hsin‐Jay; Chen, Yu Kai; Wang, Chao Hong

doi:10.1016/j.matchemphys.2008.04.018

Cited by 33 publications

(25 citation statements)

References 8 publications

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“…4,6,7,[21][22][23][24][25] In the DSC measurements with Cu, Ni, and Ag substrates, the compositions of the molten solders will change due to the intake of the substrate element during the heating and cooling processes. The equilibrium solidification temperature changes as well if the composition changes.…”

Section: Resultsmentioning

confidence: 99%

Size and Substrate Effects upon Undercooling of Pb-Free Solders

Huang

Chen

2009

Journal of Elec Materi

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The degrees of undercooling of various Pb-free solders are determined using differential scanning calorimetry. The effects of size, composition, and substrate upon undercooling are examined. Ni is the most effective element among Cu, Ni, and Ag in reducing the undercooling of Sn solders, both as an alloying addition and as a substrate. The degrees of undercooling and their variations are more significant for smaller-sized solders, but the relative orders of undercooling of various solders remain the same. It is concluded that the primary factors controlling undercooling are the primary solidification phase and the substrate. Different compositions of melts could have different primary solidifications, resulting in different degrees of undercooling. When the primary solidification phase and the substrates are the same, the degrees of undercooling could be different if the compositions of the melts are different. However, this compositional effect is not very significant.

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Section: Resultsmentioning

confidence: 99%

Size and Substrate Effects upon Undercooling of Pb-Free Solders

Huang

Chen

2009

Journal of Elec Materi

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“…Further, NiBi 3 and NiBi phases were reportedly formed during connection with a Ni substrate (formation of the interface reaction layer differs depending on the Ag composition of Bi-Ag solders) (Song et al, 2006;Shi et al, 2010;Iseki & Takamori, 2012). In the case of Sn-based solder alloys, Cu 3 Sn and Ni 3 Sn 4 IMCs were reportedly formed when the solder joined with Cu and Ni substrates (Chen et al, 2006(Chen et al, , 2008. As summarized in Table 2, the number of papers that have studied the interface reaction layer is still small, and the research results consist only of simple phase analysis using …”

Section: Interfacial Reaction Between High-temperature Pb-free Soldermentioning

confidence: 99%

“…In previously published papers, the interface reaction layer between the solder and the substrate has generally been investigated by a combination of microstructural analysis using SEM, chemical composition analysis using energy dispersive X-ray spectroscopy (EDS), and phase analysis using X-ray diffraction (XRD) in conjunction with phase diagrams (Chen et al, 2006;Song et al, 2006;Chen et al, 2008;Takaku et al, 2008;Hui et al, 2009;Kim et al, 2009aKim et al, , 2009bHaque et al, 2010aHaque et al, , 2010bMahmudi & Eslami, 2010;Shi et al, 2010;Takahashi et al, 2010;Haque et al, 2012;Iseki & Takamori, 2012;Wang et al, 2012). However, SEM and EDS analysis cannot yield accurate results because of technical limitations such as low spatial resolution (large electron beam-specimen interaction volume) and ambiguous peaks and noise signals.…”

Section: Need For Transmission Electron Microscopy Analysismentioning

confidence: 99%

Development of High-Temperature Solders: Contribution of Transmission Electron Microscopy

Bae

Shin

Lee

et al. 2015

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This article briefly reviews the results of recently reported research on high-temperature Pb-free solder alloys and the research trend for characterization of the interfacial reaction layer. To improve the product reliability of high-temperature Pb-free solder alloys, thorough research is necessary not only to enhance the alloy properties but also to characterize and understand the interfacial reaction occurring during and after the bonding process. Transmission electron microscopy analysis is expected to play an important role in the development of high-temperature solders by providing accurate and reliable data with a high spatial resolution and facilitating understanding of the interfacial reaction at the solder joint.

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“…In 2007, the European Union funded the COST MP 602 Action to find suitable lead-free substitutes for high temperature solders. One of the possibilities is represented by Sn-Sb and Sn-Sb-Cu based alloys as potential replacements of high-Pb solders [3,4]. Jang et al [5] report soldering behaviour of lead--free SnSb alloys on Cu foils and phased-in Cu-Cr thin film.…”

Section: Introductionmentioning

confidence: 99%

Influence of Sb and Cu in Sn-Sb-Cu alloys on wetting of Cu and Cu-solder-Cu joint strength

Šebo¹,

Švec²,

Janičkovič³

et al. 2010

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The influence of Sb (5, 10 and 20 at.%) and copper (0, 1.8, 3.4 and 3.7 at.%) in lead-free Sn-Sb-Cu solder on wetting of copper substrate at the temperature 623 K (350 • C) in air using flux and in N2+10H2 gas until 1800 s was studied by the sessile drop method. Wetting angle in air increases with the increase of Sb and Cu concentration in the solder whereas wetting in N2+10H2 practically does not depend on the Sb concentration. The influence of antimony and copper in Sn-Sb-Cu solder on the strength of Cu-solder-Cu joints prepared at the same conditions as wetting was also studied. Shear strength of the joints produced in air and in the gas mildly decreases with increasing amount of antimony and copper in both cases with the production of the joint in air as well as in the gas.The solidus and liquidus temperatures as well as heats of melting of all solders in ribbon and bulk shape were determined by differential scanning calorimetry (DSC) method.K e y w o r d s : lead-free solder, antimony, wetting, Cu-solder-Cu strength

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Interfacial reactions in the Sn–Sb/Ag and Sn–Sb/Cu couples

Cited by 33 publications

References 8 publications

Size and Substrate Effects upon Undercooling of Pb-Free Solders

Size and Substrate Effects upon Undercooling of Pb-Free Solders

Development of High-Temperature Solders: Contribution of Transmission Electron Microscopy

Influence of Sb and Cu in Sn-Sb-Cu alloys on wetting of Cu and Cu-solder-Cu joint strength

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