Interfacial reactions between Sn–57Bi–1Ag solder and electroless Ni-P/immersion Au under solid-state aging

Fuchs, C. E.; Schreck, Timo; Kaloudis, Michael

doi:10.1007/s10853-012-6257-x

Cited by 22 publications

(3 citation statements)

References 14 publications

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“…It was reported that metastable (Au,Ni)(Sn,Bi) 4 IMC nucleated more slowly, but the growth rate of (Au,Ni)(Sn,Bi) 4 IMC was faster than that of Ni 3 Sn 4 IMC. 29,30 Thus, the total IMC thickness with the ENIG surface finish was governed by (Au,Ni)(Sn,Bi) 4 IMC rather than Ni 3 Sn 4 IMC. In the case of the ENEPIG surface finish, as shown in Fig.…”

Section: Methodsmentioning

confidence: 99%

Drop Reliability of Epoxy-contained Sn-58 wt.%Bi Solder Joint with ENIG and ENEPIG Surface Finish Under Temperature and Humidity Test

Myung

Kim

et al. 2016

Journal of Elec Materi

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The influence of two kinds of surface finish, namely electroless nickel immersion gold (ENIG) and electroless nickel electroless palladium immersion gold (ENEPIG), on the interfacial reactions and drop reliability of epoxy-enhanced Sn-58 wt.%Bi solder has been investigated after temperature-humidity storage tests. The chemical composition and morphology of intermetallic compounds (IMCs) were characterized by scanning electron microscopy, energy-dispersive x-ray spectroscopy, and electron probe microanalysis. Also, the mechanical reliability of solder joints was evaluated using board-level drop tests. The Sn-Bi epoxy solder/ENEPIG joint exhibited higher IMC growth rate than the Sn-Bi epoxy solder/ENIG joint. After 500 h at 85°C/ 85% RH storage condition, new IMCs were formed on the Ni 3 Sn 4 layer in samples with both surface finishes. The results of board-level drop tests showed that the number of drops was higher for the ENIG than the ENEPIG surface finish. Solder joint fracture occurred along the interface between the solder and IMC layer for the ENIG surface finish. However, with the ENEPIG surface finish, the crack propagated between the IMCs.

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Section: Methodsmentioning

confidence: 99%

Drop Reliability of Epoxy-contained Sn-58 wt.%Bi Solder Joint with ENIG and ENEPIG Surface Finish Under Temperature and Humidity Test

Myung

Kim

et al. 2016

Journal of Elec Materi

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“…20 Several reports have also shown that an elongation property can be increased by 20% by adding 0.5-1 wt.% Ag without any noticeable increase in the melting temperature. [21][22][23][24] Another complementary solution for reducing brittleness is the addition of epoxy in Sn-Bi alloys, which can enhance the bonding of the solder with the bonding pad by the formation of an epoxy wall surrounding the solder after the reflow process. In our previous study, shear and drop tests were carried out with the Sn-58Bi solders with/without epoxy enhancement with an organic solderability preservative (OSP) surface finish; these studies showed that the addition of epoxy enhanced the bonding strength of Sn-58Bi solder joints.…”

Section: Introductionmentioning

confidence: 99%

Evaluation of the Bondability of the Epoxy-Enhanced Sn-58Bi Solder with ENIG and ENEPIG Surface Finishes

Myung

Kim

Jung

2015

Journal of Elec Materi

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The effect of different surface finishes, electroless nickel immersion gold (ENIG) and electroless nickel electroless palladium immersion gold (EN-EPIG), on the mechanical properties of Sn-58Bi bumps made with solder paste enhanced with epoxy were investigated. The microstructure and fracture surfaces were observed with scanning electron microscopy, and the compositions of the IMC and solder were measured using energy dispersive spectrometry and an electron probe micro-analyzer (EPMA). To evaluate the mechanical properties, low-speed shear tests and board-level drop tests were performed. The result of the shear tests showed that the bonding strength of the epoxy-enhanced Sn-58Bi solder bumps was higher than that of Sn-58Bi solder for all surface finishes, because of the epoxy surrounding the solder, and the fracture surfaces of epoxy-enhanced Sn-58Bi indicated ductile fracture in the solder joint. However, the result of the drop tests showed that samples with the ENIG and ENEPIG surface finishes had lower drop numbers compared to the sample without these surface finishes. The lower performance resulted from insufficient ejection of epoxy from the ENIG and ENEPIG surface finishes during reflow, which reduced the interfacial bonding area.

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“…Wettability of eutectic Sn-Bi is smaller than 45° on copper substrate and it has higher yield strength and fracture strength at room temperature [8]. Small amount of Au or Ag addition can improve its thermal fatigue life and ductility [9][10][11].…”

Section: Introductionmentioning

confidence: 99%

Effects of stacking sequence of electrodeposited Sn and Bi layers on reflowed Sn-Bi solder alloys

Lee

Goh

Haseeb

2012

2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT)

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Eutectic Sn-Bi alloy is gaining considerable attention in the electronic packaging applications. This alloy exhibits favorable properties such as low melting temperature, good wettability, high yield strength and fracture strength at room temperature. Miniaturization of electronic devices limited the choices of deposition technique where electrodeposition is identified as one of the most suitable ones. This work focuses on the formation of eutectic Sn-Bi solder alloys by reflowing a metal stack containing sequentially electrodeposited Sn and Bi layers. Three layer sequential deposition of Sn-Bi alloys is a new attempt in the electroplating field. The effects of layer sequence on the composition and microstructure of the resulting alloy is investigated. Irrespective of the layering sequence, a homogeneous microstructure is achieved after reflow. Near eutectic alloy of composition Sn-54.6 wt.% Bi is obtained from this sequential plating method.

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Interfacial reactions between Sn–57Bi–1Ag solder and electroless Ni-P/immersion Au under solid-state aging

Cited by 22 publications

References 14 publications

Drop Reliability of Epoxy-contained Sn-58 wt.%Bi Solder Joint with ENIG and ENEPIG Surface Finish Under Temperature and Humidity Test

Drop Reliability of Epoxy-contained Sn-58 wt.%Bi Solder Joint with ENIG and ENEPIG Surface Finish Under Temperature and Humidity Test

Evaluation of the Bondability of the Epoxy-Enhanced Sn-58Bi Solder with ENIG and ENEPIG Surface Finishes

Effects of stacking sequence of electrodeposited Sn and Bi layers on reflowed Sn-Bi solder alloys

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