A study of a tungsten (W) thin film deposited on a single crystalline 6H-SiC substrate and annealed in Ar at temperatures of 700 C, 800 C, 900 C and 1000 C for 1 hour was conducted. The subsequent solid state reactions, phase composition and surface morphology were investigated by Rutherford backscattering spectrometry (RBS), grazing incidence X-ray diffraction (GIXRD) and scanning electron microscopy (SEM)analysis techniques. RBS analysis of as-deposited samples indicated the presence of W and oxygen in the as-deposited thin film, the GIXRD analysis of the as-deposited film showed the presence of W, WO 3 , An increase in the peak intensities of the GIXRD patterns was observed due to a change in the polycrystalline nature of the W film to a more crystalline structure. SEM micrographs of the as-deposited samples indicated that the W thin film had a uniform surface with small grains. Annealing at 700 C and above led to the formation of large crystals. The large crystals formed were randomly orientated; it was observed that an increase in annealing temperature led to an increase in the film crystal size forming pores between crystals.