Interfacial reaction behavior and mechanical properties of ultrasonically brazed Cu/Zn–Al/Cu joints

Xiao, Yong; Li, Mingyu; Wang, Ling; Huang, Shangyu; Du, Xiaodong; Liu, Zhi-Quan

doi:10.1016/j.matdes.2015.02.016

Cited by 50 publications

(20 citation statements)

References 25 publications

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“…To avoid deterioration of these basic metals and to achieve strong resultant joints, much more efforts have been contributed to develop affordable solder/filler metal with suitable melting temperatures [5,6]. Furthermore, in multi-step joining of complicated parts, e.g.…”

Section: Introductionmentioning

confidence: 99%

Influence of intermetallic growth on the mechanical properties of Zn–Sn–Cu–Bi/Cu solder joints

Xing

Yao

Liang

et al. 2015

Journal of Alloys and Compounds

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Section: Introductionmentioning

confidence: 99%

Influence of intermetallic growth on the mechanical properties of Zn–Sn–Cu–Bi/Cu solder joints

Xing

Yao

Liang

et al. 2015

Journal of Alloys and Compounds

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“…Currently, Zn based alloys have been emerged as potential candidate in substituting health hazardous Pb containing solders. In recent years engineers have become interested in developing Znbased solders due to its competitive price and mechanical properties [15][16][17][18][19][20].…”

Section: Introductionmentioning

confidence: 99%

Study of off-eutectic Zn–xMg high temperature solder alloys

Galib

Hasan

Sharif

2016

J Mater Sci: Mater Electron

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Researchers have been working for some times to develop a Pb-free substitute for high-Pb containing solders in electronics. In this study the effect of Mg content on microstructure, melting behavior, thermal, electrical and mechanical properties of a new high-temperature Pb-free solder based on binary Zn-Mg alloy were investigated. The nominal compositions of Zn-xMg (x = 0.5-6.0) alloys were synthesized by conventional melting and casting route. The microstructures of the solders changed significantly on adding Mg content. Higher Mg containing alloys were found rich in intermetallic phases. The formation of the Mg 2 Zn 11 and metastable MgZn 2 intermetallic phases were identified and were also quantified by X-ray diffraction analysis. The presence of higher amount of intermetallic compounds in hypereutectic Zn-Mg systems deteriorated the tensile properties of the binary alloy. The results of electrical resistivity test indicated that the Mg could elevate the resistivity of newly developed Zn-Mg alloys. The melting behavior of the solder alloys studied by differential thermal analysis (DTA) analysis revealed that the melting temperature range of the solder alloys narrowed with Mg addition. Thermal mechanical analysis (TMA) analysis revealed that the co-efficient of thermal expansion (CTE) decreased on increasing Mg content.

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“…The mutual diffusion and reaction of these two elements were driven by the differences in concentration between the solder and the substrate matrix. By virtue of the high diffusion rates of Cu and Zn atoms in CuZn 4 layers, as reported by Gancarz and Xiao et al [22,30], Cu 5 Zn 8 could rapidly grow to form into the thickest layer among the various Cu-Zn IMC layers. The faster diffusion rate of the Zn element also triggered a vacancy flux in the opposite direction, generating vacancies in the CuZn 4 near the Cu 5 Zn 8 phase.…”

Section: Diffusional Formation Mechanism Of Imcs In Zn-al Solder Intementioning

confidence: 81%

“…6 b) shows the individual Cu-Zn IMC thicknesses; the γ-Cu 5 Zn 8 interlayer was the thickest among them, and the CuZn 4 was the layer of intermediate thickness. Previous studies have reported that the rapid growth of Cu 5 Zn 8 is a result of the high diffusion rates of Cu and Zn atoms in the CuZn 4 phase [22,30]. By contrast, the growth rate of CuZn was the slowest among the three Cu-Zn IMCs, with this layer reaching a maximum thickness of 2.5 μm after 30 min of reaction.…”

Section: Evolution Of Imc Morphologies During Liquid-solid Reactionmentioning

confidence: 85%

Diffusion barrier property of electroless Ni-W-P coating in high temperature Zn-5Al/Cu solder interconnects

Liu

Chen

Zhou

et al. 2017

Journal of Alloys and Compounds

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The operating temperature of high-temperature electronics can significantly promote the growth of intermetallic compounds (IMCs) at solder/substrate interfaces, particularly for low-cost Zn-based solders because of the rapid rate of reaction of Zn with Cu. Thus, a reliable and robust diffusion barrier is indispensable for suppressing the reactions between solder and substrate. In this work, a ternary Ni-W-P alloy was prepared via electroless plating. Its diffusion barrier property was evaluated by comparing the microstructures of IMC layers in Zn-5Al/Ni-W-P/Cu and Zn-5Al/Cu interconnects after liquid-solid reaction for prolonged durations. When the reaction lasted for 30 min, the thickness of the Al 3 Ni 2 produced in the Zn-5Al/Ni-W-P/Cu solder interconnects was only 2.15 μm, whereas the thickness of the interfacial layer of Cu-Zn IMCs (CuZn 4 , Cu 5 Zn 8 and CuZn) at the Zn-5Al/Cu interface was 94 μm. Because of the unbalanced growth of the IMCs in the Zn-5Al/ Cu interconnects, notable numbers of Kirkendall voids were identified at the CuZn 4 /Cu 5 Zn 8 , Cu 5 Zn 8 /CuZn and CuZn/Cu interfaces after prolonged liquid-solid reaction. By contrast, the Al 3 Ni 2 layer in the Zn-5Al/ Ni-W-P/Cu solder joints remained intact, showing the potential to effectively enhance the mechanical reliability of electronic devices.

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Interfacial reaction behavior and mechanical properties of ultrasonically brazed Cu/Zn–Al/Cu joints

Cited by 50 publications

References 25 publications

Influence of intermetallic growth on the mechanical properties of Zn–Sn–Cu–Bi/Cu solder joints

Influence of intermetallic growth on the mechanical properties of Zn–Sn–Cu–Bi/Cu solder joints

Study of off-eutectic Zn–xMg high temperature solder alloys

Diffusion barrier property of electroless Ni-W-P coating in high temperature Zn-5Al/Cu solder interconnects

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