Interfacial Intermetallic Growth and Strength of Composite Lead-Free Solder Alloy Through Isothermal Aging

Sivasubramaniam, V.; Bosco, Nick; Janczak‐Rusch, Jolanta; Botsis, J.

doi:10.1007/s11664-008-0524-2

Cited by 20 publications

(16 citation statements)

References 17 publications

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“…These results are in agreement with data reported in the literature. 19,22 The microstructural analysis of the shear test specimens produced with SAC405+Ni revealed an increased thickness of 10.1 lm and a more planar morphology for the reaction layer, as shown in Fig. 5.…”

Section: Microstructural Analysismentioning

confidence: 92%

“…The average reaction layer thickness at the substrate/ solder interface was determined by using the technique adopted in a previous study by the authors. 19 Shear tests were performed on an Instron 5848 Micro Tester with an imposed displacement rate of 2 lm/min. A sequence of high-resolution images of the joints was recorded during the test using an optical microscope at magnifications of 249 to 489.…”

Section: Design and Fabrication Of Joint Specimens For Shear Testingmentioning

confidence: 99%

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A Study of the Shear Response of a Lead-Free Composite Solder by Experimental and Homogenization Techniques

Sivasubramaniam

Galli

Janczak‐Rusch

et al. 2009

Journal of Elec Materi

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The current study proposes a combined experimental and modeling approach to characterize the mechanical response of composite lead-free solders. The influence of the reinforcement volume fraction on the shear response of the solder material in the joint is assessed. A novel optimized geometry for single lap shear specimens is proposed. This design minimizes the effect of plastic strain localization, leading to a significant improvement of the quality of experimental data. The constitutive model of the solder material is numerically identified from the load-displacement response of the joint by using inverse finite element identification. Experimental results for a composite solder with 0.13 reinforcement volume fraction indicate that the presence of the reinforcement leads to a 23% increase of the ultimate stress and a 50% decrease of the ultimate strain. To interpret experimental data and predict the elastoplastic response of the composite solder for varying particle volume fraction, a three-dimensional (3D) homogenization model is employed. The agreement between experiments and homogenization results leads to the conclusion that the increase in the ultimate strength and the decrease in ductility are to be attributed to load sharing between matrix material and particles with the development of a significant triaxial stress state which restricts plastic flow in the matrix.

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Section: Microstructural Analysismentioning

confidence: 92%

Section: Design and Fabrication Of Joint Specimens For Shear Testingmentioning

confidence: 99%

A Study of the Shear Response of a Lead-Free Composite Solder by Experimental and Homogenization Techniques

Sivasubramaniam

Galli

Janczak‐Rusch

et al. 2009

Journal of Elec Materi

Self Cite

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“…Most of the solder matrix composites are reinforced with ceramic particles like ZrO 2 , Al 2 O 3 , TiO 2 , SiC, Cu 2 O, SnO 2 , La 2 O 3 . [7,18,19,[21][22][23][24][25] The reinforcing particles suppress growth of intermetallic compounds (IMC) and provide uniform stress distribution in the matrix. [8,18,19] This method of nanotechnology would provide high strength and reliable solders for microelectronic packaging devices.…”

Section: Synthesis Of Nanocomposites Soldersmentioning

confidence: 99%

Pulse Electrodeposition of Lead-Free Tin-Based Composites for Microelectronic Packaging

Sharma¹,

Das²,

Das³

2016

Electrodeposition of Composite Materials

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This chapter provides a detailed overview of the various Sn-based composites solders reinforced with ceramic nanoparticles. These solders are lead free in nature and are produced by various process like powder metallurgy, ball milling, casting as well as simple and economic pulse co-electrodeposition technique. In this chapter, various electrodeposited composite solders, their synthesis, characterization, and evaluation of various properties for microelectronic packaging applications, such as microstructure, microhardness, density and porosity, wear and friction, electrochemical corrosion, melting point, electrical resistivity, and residual stress of the monolithic Sn-based and (nano)composite solders have been presented and discussed. This chapter is divided into the following sections: such as introduction to microelectronic packaging, synthesis routes for solders and composites, various nanoreinforcement, and the mechanism of incorporation in solder matrix, the pulse co-electrodeposition technique, the various factors affecting composite deposition, and the improved properties of composite solders over monolithic solders for microelectronic packaging applications are also summarized here.

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“…In many cases, the two IMCs are not differentiated but the total IMC thickness is commonly reported as a single value. [21][22][23][24][25][26][27] This does not give a complete picture of the kinetics of the reactive diffusion processes between Cu and Sn. Structural and diffusion properties in the Cu-Sn system have been investigated since the 1960s by Starke et al [28] who determined the diffusion coefficients of Cu-Sn IMC phases.…”

Section: Introductionmentioning

confidence: 99%

Intermetallic Layer Growth Kinetics in Sn‐Ag‐Cu System using Diffusion Multiple and Reflow Techniques

2014

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A diffusion multiple (DM) technique was applied to the Sn-Ag-Cu ternary system with the aim to determine the kinetics of formation of Cu-Sn intermetallic compounds (IMCs) and to predict properties of the interface in the solder joints. The formation and growth of the Cu-Sn intermetallics at the interface between the Cu as a base material and Sn-Ag-(Cu) solder was additionally studied during a standard reflow soldering process. Based on the experimental data, the kinetic rate constants and the respective activation energies of the Cu-Sn IMCs in the temperature range between 150 and 200°C were calculated and compared with experimental data from the literature. In this way, the mechanism of the pure solid-state reaction (DM technique) and liquid phase reaction (reflow soldering) were studied. The limitations of DM techniques for the prediction of the IMCs growth during reflow soldering process are discussed as well.

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Interfacial Intermetallic Growth and Strength of Composite Lead-Free Solder Alloy Through Isothermal Aging

Cited by 20 publications

References 17 publications

A Study of the Shear Response of a Lead-Free Composite Solder by Experimental and Homogenization Techniques

A Study of the Shear Response of a Lead-Free Composite Solder by Experimental and Homogenization Techniques

Pulse Electrodeposition of Lead-Free Tin-Based Composites for Microelectronic Packaging

Intermetallic Layer Growth Kinetics in Sn‐Ag‐Cu System using Diffusion Multiple and Reflow Techniques

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