2023
DOI: 10.1007/s10854-022-09609-4
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Interfacial IMC growth behavior and mechanical properties of Cu/Sn58Bi/Cu and Cu/Sn58Bi–0.05AlN/Cu solder joints under ultrasonic-assisted soldering

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“…The formation of a joint involves a process of diffusion between Ga and Mg to form IMCs. Similar to the low-temperature joining of copper [23][24][25][26], the formation of IMCs makes the joining of magnesium alloys successful at low temperatures. Before applying ultrasound, wetting had already occurred between the solder and base metals due to the affinity between them.…”
Section: Microstructure Of Jointmentioning
confidence: 99%
“…The formation of a joint involves a process of diffusion between Ga and Mg to form IMCs. Similar to the low-temperature joining of copper [23][24][25][26], the formation of IMCs makes the joining of magnesium alloys successful at low temperatures. Before applying ultrasound, wetting had already occurred between the solder and base metals due to the affinity between them.…”
Section: Microstructure Of Jointmentioning
confidence: 99%