2008
DOI: 10.1016/j.scriptamat.2007.10.011
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Interfacial characterization of Cu/diamond composites prepared by powder metallurgy for heat sink applications

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Cited by 253 publications
(107 citation statements)
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“…Composite properties can then be derived using the Maxwell Mean Field (Hasselman and Johnson, 1987) or the Differential Effective Medium models based on this effective inclusion thermal conductivity. In the cases of Al/diamond Kleiner et al, 2006) and Cu(Cr)/diamond (Schubert et al, 2008a;Schubert et al 2008b), the formation of isolated carbides or a carbide layer, respectively, at the interface between the matrix and the diamond has been observed and is suggested to be responsible for good thermal coupling between the matrix and the particles. For Cu-based diamond composites, the absence of such a coupling layer leads, typically, to very poor adhesion and low TBC.…”
Section: = ∆ Int T J Gmentioning
confidence: 99%
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“…Composite properties can then be derived using the Maxwell Mean Field (Hasselman and Johnson, 1987) or the Differential Effective Medium models based on this effective inclusion thermal conductivity. In the cases of Al/diamond Kleiner et al, 2006) and Cu(Cr)/diamond (Schubert et al, 2008a;Schubert et al 2008b), the formation of isolated carbides or a carbide layer, respectively, at the interface between the matrix and the diamond has been observed and is suggested to be responsible for good thermal coupling between the matrix and the particles. For Cu-based diamond composites, the absence of such a coupling layer leads, typically, to very poor adhesion and low TBC.…”
Section: = ∆ Int T J Gmentioning
confidence: 99%
“…In particular, very high thermal conductivities have been achieved using diamond powder-based Metal Matrix Composites (MMC) with aluminium (Molina et al 2008;Edtmaier et al 2009), copper (Schubert et al 2008a;Weber and Tavangar, 2007;Yoshida and Morigami, 2004) or silver Weber and Tavangar 2009) as a matrix material. However, in the case of copper and silver and for production routes not including the sintering of diamonds, the adjunction of an element (e.g.…”
Section: Introductionmentioning
confidence: 99%
“…The major advantage of powder metallurgy over other methods is that small elements with near net shape could be manufactured with dimensional stability, whereas manufacturing of locally reinforced elements from composite materials with excellent surface quality shall be obtained by using pressure infiltration method [6][7][8]. There were certain constraints on manufacturing that imposing unwelcome chemical and thermal properties and some substances reactive with atmospheric oxygen in direct alloying materials that led to use of powder metallurgy techniques which is more flexible than casting, forging or extrusion and achieved improvement in bonding strength, thermo -physical properties [9][10]. By using powder metallurgy route the aluminium, titanium and vanadium particles reinforced with magnesium matrix composites are prepared and results showed that certain improvements in mechanical properties like yield strength, Ultimate tensile strength and elastic modulus than MB15 alloy [11].…”
mentioning
confidence: 99%
“…Thermal and mechanical properties of D and Cu can be combined to obtain Cu/D heat-dissipative composite materials with thermal conductivity and a CTE that can be tailored with respect to the volume fraction of diamond reinforcements. From this perspective, Cu/D composites have attracted significant interest in recent years [10][11][12][13][14] and are considered as promising thermal management materials with the following advantages over pure Cu: 1) lower density, 2) higher thermal conductivity, 3) lower CTE. The costly aspect of Cu/D composites, of which scope of application has long been restricted to small volume markets such as the military and the aerospace industries, has long been a major limit to their development.…”
mentioning
confidence: 99%
“…[11][12][13][14] In a previous study, [10] we developed a process to fabricate Cu/D composites for thermal management applications without carbide forming additives to bond the Cu matrix to the diamond reinforcements. This process consists of coating the diamond powder with Cu submicronic and nanometric particles before sintering.…”
mentioning
confidence: 99%