ecause of the importance of Si-based materials to the electronic industry, considerable effort has been devoted to studying Si and metal silicide nanowire structures. 1 Nickel silicides show low electrical resistivity and excellent thermal stability without the electron migration effect at high temperatures. They are promising candidates as the electrical contacts for Si nanowire devices because of their good compatibility with Si and small lattice mismatch at the interface. The conventional methods for fabricating Ni silicide nanowires are based on the phase transformation through annealing treatment of Ni-coated Si nanowires at temperatures higher than 550 °C in vacuum. 1 An excess of Ni coating is normally needed and has to be removed by chemical etching after reaction. The Ni silicide nanowires obtained by annealing treatment are usually polycrystalline. Ni silicide nanowires can be directly grown on the Ni thin films (10Ϫ100 nm thick) deposited on SiO 2 substrates using silane as the vapor-phase Si source. 2Ϫ4 The growth temperature is low (about 370 °C); however, the as-grown Ni silicide nanowires are polycrystalline and contain different phases.Lu et al. 5,6 demonstrated a novel method of point contact reaction to transform Si nanowires into single crystalline Ni silicide structures in an electron microscope. The Ni atoms could diffuse and interact with the Si nanowire to form a NiSi structure. The interface between the Si nanowire and the newly formed NiSi wire was atomic flat and epitaxial without any misfit dislocations. Beside NiSi/Si junctions, NiSi/Si/NiSi heterostructures were also synthesized using two Ni nanowires to touch one Si nanowire. 6 Ni displayed interesting behaviors when reacting with Si nanowires. For example, for the