Interface reaction between an electroless Ni–Co–P metallization and Sn–3.5Ag lead-free solder with improved joint reliability

Yang, Ying; Balaraju, J.N.; Huang, Yizhong; Liu, Hai; Chen, Zhong

doi:10.1016/j.actamat.2014.02.026

Cited by 51 publications

(11 citation statements)

References 40 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Electroless Co-Ni-P metallization has been studied, and Co-Ni-P has shown a slower consumption rate and better resistance to joint-strength degradation during a long-term thermal aging in comparison with Ni-P [26]. It has been reported that Co-W-P UBM increases the shear strength of lead-free solder joints under liquidstate aging [27].…”

Section: Introductionmentioning

confidence: 98%

“…Recently, Co-based UBM has attracted considerable interest because of slow interfacial reaction between Co-based UBM and solders, large joint strength, good joint reliability, and acceptable wettability [26][27][28][29][30][31][32][33][34][35][36][37][38]. Electroless Co-Ni-P metallization has been studied, and Co-Ni-P has shown a slower consumption rate and better resistance to joint-strength degradation during a long-term thermal aging in comparison with Ni-P [26].…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Microstructure and morphology of interfacial intermetallic compound CoSn3 in Sn–Pb/Co–P solder joints

Yang

2015

Microelectronics Reliability

View full text Add to dashboard Cite

Section: Introductionmentioning

confidence: 98%

Section: Introductionmentioning

confidence: 99%

Microstructure and morphology of interfacial intermetallic compound CoSn3 in Sn–Pb/Co–P solder joints

Yang

2015

Microelectronics Reliability

View full text Add to dashboard Cite

“…In the electronic packing industries, SnePb alloys have been widely used. However, because of the toxic nature of PbeSn solder alloys, the production of lead-free solders with high reliability has gained great importance in terms of miniaturized electronic inter connection [1,2]. The near-peritectic Sne5Sb Pb-free solders have prominence especially in high temperature electronic applications such as step soldering technology, flip-chip connection, solder ball connections and in the bonding of a semiconductor device onto a substrate [2].…”

Section: Introductionmentioning

confidence: 99%

Formation of novel rice-like intermetallic phases and changes in the mechanical, microstructural and electrical properties of Sn–5Sb alloys with addition Ag and Bi

Karaköse

Kılıçaslan

Çolak

2016

Journal of Alloys and Compounds

View full text Add to dashboard Cite

“…Yang et al have incorporated Co and W element in Ni-P layers. The result shows the interfacial reaction between lead free solder and Ni-Co-P (Ni-W-P) has been retarded [9,10]. The consummation rate of amorphous structure has been slowed down compared the conventional Ni-P layer.…”

Section: Introductionmentioning

confidence: 99%

Novel WO<inf>3</inf> nanoparticles modified electroless metallization to retard interfacial reaction and reinforce the reliability of solder interconnection

Chan

2015

2015 IEEE 65th Electronic Components and Technology Conference (ECTC)

View full text Add to dashboard Cite

The role of under bump metallization becomes more important to control the sharp interfacial reaction. In the study, a Ni-P-WO 3 composite layer was developed as a novel UBM for solder interconnection. It's the first time tungsten oxide nanoparticles been used in solder metallization to reinforce the joint. After surface treatment, magnetic stirring and ultrasonically processing, the uniform distribution of WO 3 nanoparticles was proved by SEM and XRD analysis. The conventional Ni-P layer was used for comparison. Microstructure evolution shows solder/Ni-P-WO 3 joint has successfully slowed down the IMC growth rate at interface under various aging conditions. WO 3 nanoparticles act as barrier to limit the atom inter-diffusion, result in controlled IMC spalling and less voids formation. Top-view IMC grains shows a finer structure on Ni-P-WO 3 UBM. The activation energy of IMC growth in solder/Ni-P-WO 3 calculated to be 47.2 KJ/mol, which is higher than that of plain solder joint. The alleviation of interfacial reaction is explained by the schematic diffusional mechanism in detail. With the incorporation of WO 3 nanoparticles, mechanical properties like shear strength and tensile strength of the solder joints have been improved. Ni-P-WO 3 UBM in solder interconnection with reinforced reliability is proved to be a potential replacement for conventional UBM for advanced electronic packaging, even can be extend to micro-bump in 3D packaging bonding.978-1-4799-8609-5/15/$31.00 ©2015 IEEE

show abstract

Interface reaction between an electroless Ni–Co–P metallization and Sn–3.5Ag lead-free solder with improved joint reliability

Cited by 51 publications

References 40 publications

Microstructure and morphology of interfacial intermetallic compound CoSn3 in Sn–Pb/Co–P solder joints

Microstructure and morphology of interfacial intermetallic compound CoSn3 in Sn–Pb/Co–P solder joints

Formation of novel rice-like intermetallic phases and changes in the mechanical, microstructural and electrical properties of Sn–5Sb alloys with addition Ag and Bi

Novel WO<inf>3</inf> nanoparticles modified electroless metallization to retard interfacial reaction and reinforce the reliability of solder interconnection

Contact Info

Product

Resources

About