Novel WO<inf>3</inf> nanoparticles modified electroless metallization to retard interfacial reaction and reinforce the reliability of solder interconnection
Abstract:The role of under bump metallization becomes more important to control the sharp interfacial reaction. In the study, a Ni-P-WO 3 composite layer was developed as a novel UBM for solder interconnection. It's the first time tungsten oxide nanoparticles been used in solder metallization to reinforce the joint. After surface treatment, magnetic stirring and ultrasonically processing, the uniform distribution of WO 3 nanoparticles was proved by SEM and XRD analysis. The conventional Ni-P layer was used for comparis… Show more
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