Interface formation evolution of the hot-forged copper-(Cr)diamond composite and its thermal conductivity

Effect of Hot-Pressing Pressure on the Microstructure and Thermal Conductivity of Copper/Ti-Coated Diamond Composites

“…Furthermore, when the pressure is below 400MPa, the particle size of TiC on diamond-( 111) is coarser than that on the diamond-(100) facets, while as the pressing pressure is higher than 400MPa, the average size of TiC on diamond-( 111) is smaller than that on diamond-(100) facets. This indicates that diamond-(111) facet has a relatively fast growth rate of TiC compared to diamond-(100) facet under the pressure of 300MPa, this is attributed to diamond-(100) has higher surface energy than diamond-(111), therefore, there will be a surface reconstruction on (100) facet before the reaction between Ti and C atoms, and the sp 2 carbon is easier to be formed on the diamond-(111) which are used to react with Ti coating [16], and the growth rate of TiC on the diamond-(100) exceeds that on the diamond-(111) facets as the hot-pressing pressure is above 400MPa because diamond-(100) facets have less C-C bonds need to be broken to form TiC after the surface reconstruction [17].…”