Double layer interfacial structure of Cr3C2–Cr7C3 in copper/diamond composites for thermal management applications

Chen, Wei; Wang, Fengyi; Fan, Lining; Zheng, Hui; Guo, Xiaoxiao; Zheng, Peng; Zheng, Liang; Zhang, Yang

doi:10.1016/j.applthermaleng.2024.123958

Applied Thermal Engineering

2024

DOI: 10.1016/j.applthermaleng.2024.123958

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Double layer interfacial structure of Cr3C2–Cr7C3 in copper/diamond composites for thermal management applications

Wei Chen,

Fengyi Wang,

Lining Fan

et al.

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Double layer interfacial structure of Cr3C2–Cr7C3 in copper/diamond composites for thermal management applications

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References 35 publications

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