Interface crack analysis of piezoelectric laminates considering initial strain

Yu, Hongjun; Zhu, Shuai; Ma, Haoyu; Wang, Jianshan

doi:10.1016/j.ijmecsci.2024.109104

Cited by 1 publication

(1 citation statement)

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“…The dynamic behavior of elastic laminates with interface delamination and interaction surfaces was simulated using the boundary integral equation method [31]. Furthermore, the transient response of a piezoelectric interface crack under a mechanical impact and the problem of moving interface cracks [32,33], interface multiple cracks [34][35][36], and inhomogeneous piezoelectric interface cracks [37,38] were studied.…”

Section: Introductionmentioning

confidence: 99%

Analysis of an Interface Crack between Piezoelectric Semiconductor Coating and Elastic Substrate Structure

Tian,

Zhang,

et al. 2024

Mathematics

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Piezoelectric semiconductor materials possess a unique combination of piezoelectric and semiconductor effects, exhibiting multifaceted coupling properties such as electromechanical, acoustic, photoelectric, photovoltaic, thermal, and thermoelectric capabilities. This study delves into the anti-plane mechanical model of an interface crack between a strip of piezoelectric semiconductor material and an elastic material. By introducing two boundary conditions, the mixed boundary value problem is reformulated into a set of singular integral equations with a Cauchy kernel. The details of carrier concentration, current density, and electric displacement near the crack are provided in a numerical analysis. The findings reveal that the distribution of the current density, carrier concentration, and electric displacement is intricately influenced by the doping concentration of the piezoelectric semiconductor. Moreover, the presence of mechanical and electric loads can either expedite or decelerate the growth of the crack, highlighting the pivotal role of external stimuli in influencing material behavior.

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