2021
DOI: 10.1007/s11661-020-06131-2
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Interdiffusion of Elements During Ultrasonic Additive Manufacturing

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Cited by 14 publications
(3 citation statements)
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“…A recent theoretical calculation has revealed that the temperature increase caused by interfacial friction may surpass the recrystallisation threshold [25], and careful microscopy observations of the consolidated interface confirmed grain refinement, which is associated with dynamic recrystallisation [16,18,26]. Furthermore, dynamic recrystallisation can enhance atomic mobility and thus facilitate the formation of metallurgical bonds [27]. In the case of dissimilar metals with varying degrees of softness or hardness, such as aluminium and titanium, it is widely acknowledged that shear deformation occurring at the interface of the soft metal plays a crucial role in achieving consolidation.…”
Section: Introductionmentioning
confidence: 99%
“…A recent theoretical calculation has revealed that the temperature increase caused by interfacial friction may surpass the recrystallisation threshold [25], and careful microscopy observations of the consolidated interface confirmed grain refinement, which is associated with dynamic recrystallisation [16,18,26]. Furthermore, dynamic recrystallisation can enhance atomic mobility and thus facilitate the formation of metallurgical bonds [27]. In the case of dissimilar metals with varying degrees of softness or hardness, such as aluminium and titanium, it is widely acknowledged that shear deformation occurring at the interface of the soft metal plays a crucial role in achieving consolidation.…”
Section: Introductionmentioning
confidence: 99%
“…Al and Cu alloys have been widely investigated by UAM due to their relatively low strength and soft/ductile nature [16,[31][32][33][34][35][36]. Typically, UAM is designed to be a hybrid process, where the fusion technique is coupled with a computer numerical control system, allowing for the combination of additive and subtractive manufacturing.…”
Section: Embedding Processmentioning
confidence: 99%
“…The lower formation temperature is expected to suppress the formation of brittle intermetallics, enabling the joining of different metal combinations using UAM [9]. Other work in [10] showed that some metal interdiffusion could be observed between metallized optical fibers and a different parent metal such as Al-Cu or Ni-Au. Using thermocouples embedded at the weld interface, the work in [11] showed that the formation temperature reaches a peak value near 150 • C for welding aluminum and copper alloys with a 9 kW welder.…”
Section: Introductionmentioning
confidence: 99%