Interdiffusing metals layer technique of ceramic-metal bonding

Iino, Y.; Taguchi, Nobuyoshi

doi:10.1007/bf00720748

Cited by 14 publications

(7 citation statements)

References 3 publications

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“…Efforts were made to extent transient liquid phase (tlp™) methods for joining nickel-base superalloys to the joining of silicon nitride [6][7][8][9][10][11][12][13] and silicon carbide [14,15] ceramics. Multilayer interlayers combining lower and higher melting point metals that would homogenize by solid-state diffusion were proposed as alternatives to the homogeneous metallic interlayers normally used for solid-state diffusion bonding [16]. Joining methods utilizing multilayer metallic interlayers under conditions where a thin or partial layer of a transient liquid phase forms were also proposed [17,18].…”

Section: Introductionmentioning

confidence: 99%

Joining of alumina via copper/niobium/copper interlayers

et al. 2000

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Alumina has been joined at 1150°C and 1400°C using multilayer copper/niobium/copper interlayers. Four-point bend strengths are sensitive to processing temperature, bonding pressure, and furnace environment (ambient oxygen partial pressure). Under optimum conditions, joints with reproducibly high room temperature strengths (≈240 ± 20 MPa) can be produced; most failures occur within the ceramic. Joints made with sapphire show that during bonding an initially continuous copper film undergoes a morphological instability, resulting in the formation of isolated copper-rich droplets/particles at the sapphire/interlayer interface, and extensive regions of direct bonding between sapphire and niobium. For optimized alumina bonds, bend tests at 800°C-1100°C indicate significant strength is retained; even at the highest test temperature, ceramic failure is observed. Postbonding anneals at 1000°C in vacuum or in gettered argon were used to assess joint stability and to probe the effect of ambient oxygen partial pressure on joint characteristics. Annealing in vacuum for up to 200 h causes no significant decrease in room temperature bend strength or change in fracture path. With increasing anneal time in a lower oxygen partial pressure environment, the fracture strength decreases only slightly, but the fracture path shifts from the ceramic to the interface. Cu/Nb/Cu Interlayers R. A. Marks et al. Joining of Alumina via

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Section: Introductionmentioning

confidence: 99%

Joining of alumina via copper/niobium/copper interlayers

et al. 2000

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“…Especially in the energy industry, the application of Si 3 N 4 is expected to improve the thermal efficiency of turbine generators. However, in spite of numerous studies with great achievements and inventions, [2][3][4][5][6][7][8][9][10] it is still difficult to obtain sound joints that endure the high temperatures at which Si 3 N 4 exhibits its merits. However, in spite of numerous studies with great achievements and inventions, [2][3][4][5][6][7][8][9][10] it is still difficult to obtain sound joints that endure the high temperatures at which Si 3 N 4 exhibits its merits.…”

Section: Introductionmentioning

confidence: 99%

“…[2][3][4][5][6] On the other hand, it is well known that an inappropriate bonding of Si 3 N 4 with metals containing titanium causes the formation of brittle phases and the reduction of joint strength. For this purpose, titanium is commonly used as an active additive of filler metals or brazes for ceramics bonding.…”

Section: Introductionmentioning

confidence: 99%