Interconnection materials, processes and tools for fine-pitch panel assembly of ultra-thin glass substrates

Smet, Vanessa; Huang, Tien‐Chi; Kawamoto, Satomi; Singh, Bhupender; Pulugurtha, Markondeya Raj; Tummala, Rao

doi:10.1109/ectc.2015.7159634

Cited by 7 publications

(1 citation statement)

References 16 publications

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“…It is worth noting that this strategy enables the reuse of the current PIC design for CWDM based on a wavelength specific GC coupling scheme while athermal multiplexers/demutiplexers are integrated on glass to take advantage of its low thermo-optic coefficients [9]. Moreover, a passive alignment approach could be adopted using a pickand-place technique with ∼1 µm alignment accuracy and 3D assembly of fine pitch copper pillars [10]. In that context, the development of optical waveguides using cost effective industrial techniques and tools are of primary relevance.…”

Section: Introductionmentioning

confidence: 99%

Cost Effective Laser Structuration of Optical Waveguides on Thin Glass Interposer

Boucaud

Ayi-Yovo

Hivin

et al. 2017

J. Lightwave Technol.

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In order to enhance electro-optical system-inpackage capabilities for silicon photonics, a cost effective fabrication process for optical waveguides integration on thin glass substrate interposer is demonstrated. First, a femtosecond laser ablation coupled with a hydrofluoric acid etching is developed to create microgrooves at the glass surface. Second, a dry film lamination followed by chemical mechanical planarization is achieved to define surface optical waveguides by filling the microchannels. Physical characterizations of the fabricated waveguides are performed using optical and scanning electron microscopy. Finally, optical mode profile and loss characterizations confirm the optical functionality of waveguides which prove to be multimodal at 1550 nm.

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Section: Introductionmentioning

confidence: 99%