Interconnect

Advanced Electronic Packaging Technology: From Hard to Soft

“…Upon the dawn of the post-Moore’s law era, researchers must steer their directions to find alternative materials or structures, e.g., carbon nanotubes/graphene [ 1 , 2 ] and heterogenous integration [ 3 ], to either continue Moore’s law or surpass it (See Table 1 ). Numerous emerging technologies, such as power electronics and LiDAR for automobiles [ 4 ], have already become fast-growing and significant players in the semiconductor industry. Related packaging technologies must follow the pace of chip development to meet the increasing needs for high-speed and high-bandwidth computation in future devices.…”