A Laser-Assisted Thermal Gradient Transient Liquid Phase Bonding Process Design for Thermally Sensitive Components in Hermetic Packaging

Hu, Shizun; Song, Jiaqi; Liu, Yu; Wu, Chenran; Lei, Tianhao; Ge, Anxu; Zhang, Donglin; Zhao, Xiuchen; Huo, Yongjun; Lee, Chin C.

doi:10.1109/tcpmt.2024.3355159

IEEE Trans. Compon., Packag. Manufact. Technol.

2024

DOI: 10.1109/tcpmt.2024.3355159

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A Laser-Assisted Thermal Gradient Transient Liquid Phase Bonding Process Design for Thermally Sensitive Components in Hermetic Packaging

Shizun Hu,

Jiaqi Song,

Yu Liu

et al.

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A Laser-Assisted Thermal Gradient Transient Liquid Phase Bonding Process Design for Thermally Sensitive Components in Hermetic Packaging

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References 31 publications

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