2014
DOI: 10.1109/jsen.2013.2294626
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Integration Without Disruption: The Basic Challenge of Sensor Integration

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Cited by 53 publications
(25 citation statements)
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“…The sensors should be embedded between two plies of the fiberplane (fabric) to provide accurate results [4][5][6][7] and cannot be taken out from composite when the curing process is completed. Thus, "Sensors have to be embedded in a way which does provide the information needed for monitoring, but which does not downgrade the macroscopic behavior of the composite material" [8]. The idea is to reduce the sensor's size and to improve the compatibility of the inlay with the materials of composite (matrix and fiber).…”
Section: Introductionmentioning
confidence: 99%
“…The sensors should be embedded between two plies of the fiberplane (fabric) to provide accurate results [4][5][6][7] and cannot be taken out from composite when the curing process is completed. Thus, "Sensors have to be embedded in a way which does provide the information needed for monitoring, but which does not downgrade the macroscopic behavior of the composite material" [8]. The idea is to reduce the sensor's size and to improve the compatibility of the inlay with the materials of composite (matrix and fiber).…”
Section: Introductionmentioning
confidence: 99%
“…Furthermore, the sensor itself might reduce the adhesion of the adhesive. Due to this, the mechanical structure can be weakened which is called "the foreign body effect" [7]. Mechanical tests will be done to investigate the influence of the sensor on the mechanical strength of the bonding.…”
Section: Discussionmentioning
confidence: 99%
“…To this end, many examples of sensor integration into materials fabricated by traditional processes, such as concrete (Martínez and Andrade, 2009;Qin and Li, 2008), fiber-reinforced compounds (Hautamaki et al, 1999;Salas et al, 2014), or metals (Ibragimov et al, 2012;Klassen et al, 2012), can be found in the literature. Here, planar microfabrication of the sensor elements often results in limitations in terms of device geometry, material options, or integration challenges (Dumstorff et al, 2014).…”
Section: Introductionmentioning
confidence: 99%