The loads acting on a workpiece during machining processes determine the modification of the surface of the final workpiece and, thus, its functional properties. In this work, a method that uses thermocouples to measure the temperature in precision fly-cutting machining with high spatial and temporal resolution is presented. Experiments were conducted for various materials and machining parameters. We compare experimental measurement data with results from modern and advanced machining process simulation and find a good match between experimental and simulation results. Therefore, the simulation is validated by experimental data and can be used to calculate realistic internal loads of machining processes.
Commercial pressure sensors are often fabricated using well-established silicon micromachining technologies. The thickness and stiffness of silicon-based sensors make them in most cases unsuitable for the integration into materials and surfaces. We present a flexible pressure sensor fabricated by printing technology. Therefore, an intrinsically pressure sensitive ink is screen printed on interdigital electrodes on a thin and flexible foil substrate. The sensor shows sufficient sensitivity and is applicable in a wide pressure range from 0 to 2 MPa. The sensor can completely be fabricated using a low-cost screen printing process. It is very thin and flexible, making it possible to be applied on curved surfaces or to be integrated into materials in a minimal invasive way.
Fully screen-printed resistive pressure sensors have attracted rising attention in recent years. The possibility to fabricate them on any substrate as well as their low thickness and overall flexibility allow their application on curved surfaces or for material integrated sensing. However, these applications often apply additional loads other than only pressure to the sensors. A major concern is the cross-sensitivity of the sensors to strain. Thus, this work investigates the influence of the electrode geometry used for screen-printed pressure sensors on the device performance and on the cross-sensitivity to strain. It is shown, that the performance as well as the cross-sensitivity to strain are affected by electrode setup and orientation. The pressure sensitivity increases with the number of interdigital electrodes. The cross-sensitivity to temperature is not affected by the electrode setup.
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