2007
DOI: 10.1116/1.2647420
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Integration of electrodes in Si channels using low temperature polymethylmethacrylate bonding

Abstract: Low temperature Si to glass bonding using polymethylmethacrylate (PMMA) as an adhesive layer is developed to integrate electrodes with Si channels. The integrated microsystem contains channels dry etched in Si with widths ranging from 3to100μm and depths ranging from 100nmto30μm. The channels are bonded to a 100μm thick glass consisting of 600nm thick patterned PMMA and 20∕50nm thick Cr∕Au electrodes, with PMMA as an adhesive layer. The typical bond strength is 3MPa, obtained by bonding at 110°C with 600nm thi… Show more

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Cited by 5 publications
(3 citation statements)
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“…Bonding experiments were performed with PMMA at two different bond temperatures: 90 • C and 160 • C. While the experiments at 90 • C produced higher bond strength, the samples bonded at 160 • C were much more uniform, had fewer voids and more pieces survived dicing. These results agree with the results of [27] where a higher temperature produced a more uniform bond (as explained earlier), improving uniformity and therefore chip survival. 90 • C is below the glass transition temperature for PMMA; hence, it not be to deform and fill the surface roughness of the glass.…”
Section: Temperaturesupporting
confidence: 91%
“…Bonding experiments were performed with PMMA at two different bond temperatures: 90 • C and 160 • C. While the experiments at 90 • C produced higher bond strength, the samples bonded at 160 • C were much more uniform, had fewer voids and more pieces survived dicing. These results agree with the results of [27] where a higher temperature produced a more uniform bond (as explained earlier), improving uniformity and therefore chip survival. 90 • C is below the glass transition temperature for PMMA; hence, it not be to deform and fill the surface roughness of the glass.…”
Section: Temperaturesupporting
confidence: 91%
“…The fabrication technology to integrate electrodes with sealed channels is based on bonding an array of Si channels with electrodes on a thin glass substrate using PMMA as an adhesive layer [13]. PMMA bonding is used to integrate electrodes with the channel array since PMMA does not clog the channels during bonding due to its high viscosity.…”
Section: Integration Of Electrodes In Channelsmentioning
confidence: 99%
“…10 The DNA velocity increases with the amplitude of the applied voltage and decreases with distance from the electrode pair. 11 Here we have expanded on this work by fabrication of a new system consisting of either 400 or 900 nm wide Si channels integrated with two electrode pairs. Using this dual-electrode system, we have demonstrated for the first time the ability to precisely control the motion and average position of DNA confined within microchannels using ac potential.…”
Section: Introductionmentioning
confidence: 99%