2012
DOI: 10.1088/0960-1317/22/2/025004
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Voltage-assisted polymer wafer bonding

Abstract: Polymer wafer bonding is a widely used process for fabrication of microfluidic devices. However, best practices for polymer bonds do not achieve sufficient bond strength for many applications. By applying a voltage to a polymer bond in a process called voltage-assisted bonding, bond strength is shown to improve dramatically for two polymers (Cytop TM and poly(methyl methacrylate)). Several experiments were performed to provide a starting point for further exploration of this technique. An optimal voltage range… Show more

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Cited by 4 publications
(4 citation statements)
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“…Electrostatic force is employed in various applications, such as fabric handling [ 2 , 3 , 4 ], electrostatic chuck (ESC) handling of silicon wafers [ 5 , 6 ], handling rough objects [ 7 , 8 ], levitation and transportation of silicon wafers [ 9 ] and electrostatic glass actuators [ 10 ]. Apart from this, electroadhesion is used in a complementary manner as reported in the literature, such as assisted wafer bonding [ 11 ], tuning the mechanical behavior of structural elements [ 12 ] and tuning the frictional damping behavior of structures [ 13 ]. It also finds its usage in robotic applications, such as a latching mechanism for modular robots [ 14 , 15 ] and wall climbing robots [ 16 , 17 , 18 , 19 , 20 , 21 , 22 ].…”
Section: Introductionmentioning
confidence: 99%
“…Electrostatic force is employed in various applications, such as fabric handling [ 2 , 3 , 4 ], electrostatic chuck (ESC) handling of silicon wafers [ 5 , 6 ], handling rough objects [ 7 , 8 ], levitation and transportation of silicon wafers [ 9 ] and electrostatic glass actuators [ 10 ]. Apart from this, electroadhesion is used in a complementary manner as reported in the literature, such as assisted wafer bonding [ 11 ], tuning the mechanical behavior of structural elements [ 12 ] and tuning the frictional damping behavior of structures [ 13 ]. It also finds its usage in robotic applications, such as a latching mechanism for modular robots [ 14 , 15 ] and wall climbing robots [ 16 , 17 , 18 , 19 , 20 , 21 , 22 ].…”
Section: Introductionmentioning
confidence: 99%
“…On the other hand, it accelerates the interface reaction, which reduces the joining temperature, the pressure, and the residual stress. Moreover, the interface reaction is easy to control, and joining time is very short [96][97][98]101].…”
Section: Electric-assisted Fieldmentioning
confidence: 99%
“…Microfluidic channels are etched into the CYTOP layer using a photoresist mask and an oxygen plasma etch. The coverslip is bonded to the wafer with the waveguides, plasmonic stripes, and access holes using a voltage-assisted bond procedure [47].…”
Section: Fabrication Proceduresmentioning
confidence: 99%