2017
DOI: 10.1016/j.diamond.2017.08.008
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Integrated temperature sensor with diamond Schottky diodes using a thermosensitive parameter

Abstract: , et al.. Integrated temperature sensor with diamond Schottky diodes using a thermosensitive parameter. Diamond and Related Materials, Elsevier, 2017, 78, pp.83-87. 10.1016/j.diamond.2017 Integrated temperature sensor with diamond Schottky diodes using a thermosensitive parameter. However, self-heating during characterization process has been widely observed and fast and high temperature monitoring is highly desired, moreover temperature management is of high interest for device parallelization. In this artic… Show more

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Cited by 28 publications
(16 citation statements)
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“…However, the total current is limited with this design due to the lateral current flow in the p+ layer. Interactions between diodes are also observed using this design [17]. Nevertheless, good properties are obtained such as high current density and high breakdown voltage [5].…”
Section: Brief Review Of Diamond Diodesmentioning
confidence: 83%
“…However, the total current is limited with this design due to the lateral current flow in the p+ layer. Interactions between diodes are also observed using this design [17]. Nevertheless, good properties are obtained such as high current density and high breakdown voltage [5].…”
Section: Brief Review Of Diamond Diodesmentioning
confidence: 83%
“…Accepted version (Elsevier, DRM2020): https://doi.org/10.1016/j.diamond.2020.108154 resistance. Such a closed loop forced convection control can be possible by using a junction temperature estimation of the device in operation in the power converter [43]. This solution can be analyzed with a particular care on the dynamic response of the temperature control loop to avoid the diamond device thermal runaway.…”
Section: Discussionmentioning
confidence: 99%
“…SDs use epitaxial silicon [19,25,[27][28][29] and polysilicon structures [11] of n -or p-type conductivity with array of different metal, silicon carbide 4H-SiC with barrier metal of Ni [16,20], Ti [30,31], Pt [32] and V2O5 [18], as well as working layers of GaN [17,33] or graphene [34,35] and many other combinations. Semiconductor structures and sapphire [17] or diamond [19] insulators were chosen as substrate for developments. Additionally, SDs were created on SOI wafers [12,13,34,36].…”
Section: Introductionmentioning
confidence: 99%