2021
DOI: 10.36227/techrxiv.14891673
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Schottky diode temperature sensor for pressure sensor

Abstract: The small silicon chip of Schottky diode (0.8x0.8x0.4 mm<sup>3</sup>) with planar arrangement of electrodes (chip PSD) as temperature sensor, which functions under the operating conditions of pressure sensor, was developed. The forward I-V characteristic of chip PSD is determined by potential barrier between Mo and n-Si (N<sub>D</sub> = 3 × 10<sup>15</sup> cm<sup>-3</sup>). Forward voltage U<sub>F</sub> = 208 ± 6 mV and temperature coefficient TC = -1… Show more

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Cited by 2 publications
(2 citation statements)
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“…The sensor assembly allows for measuring differential pressure. All samples were exposed to temperature and pressure cycling to remove residual assembly stress before functional testing [23][24][25][26][27][28].…”
Section: Structure and Modelingmentioning
confidence: 99%
“…The sensor assembly allows for measuring differential pressure. All samples were exposed to temperature and pressure cycling to remove residual assembly stress before functional testing [23][24][25][26][27][28].…”
Section: Structure and Modelingmentioning
confidence: 99%
“…The sensor assembly allows for measuring differential pressure. All samples were exposed to temperature and pressure cycling to remove residual assembly stress before functional testing [33][34][35][36][37]. Pressure sensors with PDA-NFL chip were compared with similar products utilizing Wheatstone bridge circuit having the same or similar pressure range: 1) mass-fabricated 60 kPa pressure sensor IPD60 (VNIIA), 2) high-sensitivity 5 kPa CBMP sensor (in development) [38,39], 3) ultra-high sensitivity pressure sensor [22,23] mentioned in Introduction.…”
Section: Experimental Datamentioning
confidence: 99%