Integrated even harmonic type direct conversion receiver for W-CDMA mobile terminals

Itoh, K.; Yamaguchi, T.; Katsura, T.; Sadahiro, K.; Ikushima, T.; Hayashi, R.; Ishizu, F.; Taniguchi, E.; Nishino, T.; Shimozawa, M.; Suematsu, N.; Takagi, T.; Ishida, O.

doi:10.1109/rfic.2002.1012045

Cited by 1 publication

(3 citation statements)

References 15 publications

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“…Most bond wires are [25][26][27][28][29][30] p m in diameter and between one and two millimeters in length. An approximate formula that has proven accurate at low frequencies is given by More accurate models of bond-wire inductance require full 3D simulations.…”

Section: Wire Bond Inductancementioning

confidence: 99%

“…For example, a WCDMA downconverter was demonstrated by Mitsubishi [28], which used the capabilities of LTCC to great advantage. In this case, an even-order sub-harmonic direct-conversion receiver was implemented.…”

Section: Low-temperature Co-fired Ceramic (Ltcc) Packagingmentioning

confidence: 99%

“…A crosssection of a two-stack die is shown inFigure I I .----------_ _ _ _ _ _ LTCC-based WCDMA RF direct conversion receiver[28]. Most of the passive elements were realized on the LTCC substrate, and the resulting SiGe BiCMOS die was flip-chipped onto the substrate.…”

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confidence: 99%

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Advances in RF packaging technologies for next-generation wireless communications applications [RFIC]

Larson

Jessie²

Proceedings of the IEEE 2003 Custom Integrated Circuits Conference, 2003.

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The performance of a radio frequency integrated circuir can be dramatically affecred by rhe package environmenr, yer pncknging rechnology has received comparorively lirtle attention compared ro IC fabricarion tecknology or RFIC design. This paper summarizes the key de- velopmenrs and trends in RFIC packaging, wirh particular arrenrion to improvements in plastic packnge design, low-remperarure co-fred ceramic (LTCC), flip-chip approaches, and system-in-package (SIP) implemenrarions.14-1 -1 0-7803-784~-31031$17.w 0 2W3 IEEE IEEE 2003 CUSTOM INTEGRATED CIRCUITS CONFERENCE 323

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