Instant electrode fabrication on carbon-fiber-reinforced plastic structures using metal nano-ink via flash light sintering for smart sensing

Takahashi, Kosuke; Namiki, Kensuke; Fujimura, Takahiro; Jeon, Eun Beom; Kim, Kwang Ho

doi:10.1016/j.compositesb.2015.02.012

Cited by 10 publications

(1 citation statement)

References 24 publications

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“…Research of selective laser processing and flash lamp annealing of printed nanoparticle films has provided sintering solutions that are alternatives to conventional bulk thermal routes (62)(63)(64)(65)(66). Such methods are well suited to functional electronic networks on thermally sensitive substrates and can be readily integrated into manufacturing processes (67)(68)(69).…”

Section: Particle Sintering Through Postdeposition Thermal Treatmentmentioning

confidence: 99%

Additive Manufacturing of Hybrid Circuits

Sarobol¹,

Cook²,

Keicher³

et al. 2016

Annu. Rev. Mater. Res.

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There is a rising interest in developing functional electronics using additively manufactured components. Considerations in materials selection and pathways to forming hybrid circuits and devices must demonstrate useful electronic function; must enable integration; and must complement the complex shape, low cost, high volume, and high functionality of structural but generally electronically passive additively manufactured components. This article reviews several emerging technologies being used in industry and research/development to provide integration advantages of fabricating multilayer hybrid circuits or devices. First, we review a maskless, noncontact, direct write (DW) technology that excels in the deposition of metallic colloid inks for electrical interconnects. Second, we review a complementary technology, aerosol deposition (AD), which excels in the deposition of metallic and ceramic powder as consolidated, thick conformal coatings and is additionally patternable through masking. Finally, we show examples of hybrid circuits/devices integrated beyond 2-D planes, using combinations of DW or AD processes and conventional, established processes.

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