Surfactant-templated silica thin films are potentially important materials for applications such as chemical sensing. However, a serious limitation for their use in aqueous environments is their poor hydrolytic stability. One convenient method of increasing the resistance of mesoporous silica to water degradation is addition of alumina, either doped into the pore walls during material synthesis or grafted onto the pore surface of preformed mesophases. Here, we compare these two routes to Al-modified mesoporous silica with respect to their effectiveness in decreasing the solubility of thin mesoporous silicate films. Direct synthesis of templated silica films prepared with Al/Si ) 1:50 was found to limit film degradation, as measured by changes in film thickness, to less than 15% at near-neutral pH over a 1 week period. In addition to suppressing film dissolution, addition of Al can also cause structural changes in silica films templated with the nonionic surfactant Brij 56 (C16H33(OCH2CH2)n∼10OH), including mesophase transformation, a decrease in accessible porosity, and an increase in structural disorder. The solubility behavior of films is also sensitive to their particular mesophase, with 3D phases (cubic, disordered) possessing less internal but more thickness stability than 2D phases (hexagonal), as determined with ellipsometric measurements. Finally, grafting of Al species onto the surface of surfactant-templated silica films also significantly increases aqueous stability, although to a lesser extent than the direct synthesis route.
There is a rising interest in developing functional electronics using additively manufactured components. Considerations in materials selection and pathways to forming hybrid circuits and devices must demonstrate useful electronic function; must enable integration; and must complement the complex shape, low cost, high volume, and high functionality of structural but generally electronically passive additively manufactured components. This article reviews several emerging technologies being used in industry and research/development to provide integration advantages of fabricating multilayer hybrid circuits or devices. First, we review a maskless, noncontact, direct write (DW) technology that excels in the deposition of metallic colloid inks for electrical interconnects. Second, we review a complementary technology, aerosol deposition (AD), which excels in the deposition of metallic and ceramic powder as consolidated, thick conformal coatings and is additionally patternable through masking. Finally, we show examples of hybrid circuits/devices integrated beyond 2-D planes, using combinations of DW or AD processes and conventional, established processes.
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