Inorganic Anions and Copper Pitting

Edwards, Marc; Rehring, John; Meyer, Travis E

doi:10.5006/1.3294345

Cited by 44 publications

(40 citation statements)

References 1 publication

Supporting

Mentioning

Contrasting

Unclassified

Order By: Relevance

“…ratios lower the pitting potential of copper. This trend is expected to follow for copper tubing (phosphorus deoxidized copper) (21) (46). However, critical potentials may be a little lower.…”

Section: -mentioning

confidence: 96%

Passivity and Pit Stability Behavior of Copper as a Function of Selected Water Chemistry Variables

2009

View full text Add to dashboard Cite

The electrochemical pitting behavior of UNS C11000 copper was investigated in a synthetic potable water found to cause pitting. Tests were also conducted in several other HCO3-, SO42- and Cl- containing-waters. Studies of the effect of water chemistry on passivity, uniform corrosion, and pitting were accomplished using the cyclic voltammetry method. Certain water chemistry concentrations promote pitting. High [SO42-]/[OH-],[SO42-]/[HCO3-] and [Cl-]/[HCO3-] ratios lower pitting potentials while an increase in alkalinity improves passivity and raises pitting potentials. HCO3-/CO32- can protect copper surfaces by forming carbonate containing minerals. However, carbonated species are less beneficial towards passivity compared to OH- with respect to passivation efficiency. Empirical equations that forecast pitting and repassivation potentials as a function of selected water chemistry variables were developed by linear regression analysis based on experimental pitting and repassivation potential trends with HCO3-, Cl- and SO42- content. The origins of the trends with water chemistry variables are discussed.

show abstract

Section: -mentioning

confidence: 96%

Passivity and Pit Stability Behavior of Copper as a Function of Selected Water Chemistry Variables

2009

View full text Add to dashboard Cite

show abstract

“…However, it is much more difficult to carry out a wet etching technique on bulk metals than on semiconductor materials, because (i) spontaneous corrosion occurs easily on the most widely used metals (such as copper, nickel and aluminum) in solution [13][14][15][16][17][18] and (ii) the crystal boundaries of metals possess higher potential energies and are more easily corroded than the crystal grains. It is therefore desirable to develop a technique for micro fabricating complicated three-dimensional structures of important industrial metals [19][20][21].…”

Section: Introductionmentioning

confidence: 99%

Three-dimensional micro-fabrication on copper and nickel

Jiang

Liu

Tang

et al. 2005

Journal of Electroanalytical Chemistry

View full text Add to dashboard Cite

“…The efficacy of these constituents in copper pitting mitigation has been suggested by several authors [3,5,6] and some favorable data from full-scale testing [29]. Some research has also demonstrated that anionic NOM may also function as a very effective pitting inhibitor, even at relatively small concentrations [9,11,12,30]. However, to date, the dependency between dose and effectiveness for each of these constituents has not been established nor has substantive information been gathered as to their specific functions (i.e., as anodic or cathodic pitting inhibitors, or both).…”

Section: Anodic and Cathodic Inhibitorsmentioning

confidence: 99%

“…While pipe-loop studies offer a proven means gathering meaningful forensic data [3], they have seldom provided mechanistic insights to pitting reactions. However, insights from older theory [12,13], as refined and confirmed in recent electrochemical studies [4,14], may be utilized as a conceptual framework for interpreting and analyzing pipeloop data relative to pit initiation and propagation phases. …”

Section: Introductionmentioning

confidence: 99%

Inhibition of Copper Pitting Corrosion in Aggressive Potable Waters

Sarver

Edwards

2012

International Journal of Corrosion

View full text Add to dashboard Cite

Copper pitting corrosion can lead to premature plumbing failures, and can be caused by aggressive potable waters characterized by high pH, free chlorine residual and low alkalinity. In such waters and under continuous flow, certain inhibitors including phosphate, silica or natural organic matter may greatly reduce pitting occurrence. In the current work, 1 mg/L phosphate (as P) completely prevented initiation of pits, and 5 mg/L silica (as Si) significantly decelerated pitting. However, much lower doses of these inhibitors had little benefit and actually accelerated the rate of attack in some cases. Effects of organic matter were dependent on both the type (e.g., natural versus ozonated humic substances) and dosage. Dose-response effects of free chlorine and alkalinity were also investigated. Based on electrochemical data, pits initiated more rapidly with increased free chlorine, but even moderate levels of chlorine (∼0.4 mg/L) eventually caused severe pitting. High alkalinity decreased pit propagation rates but did not prevent pit formation.

show abstract

Inorganic Anions and Copper Pitting

Cited by 44 publications

References 1 publication

Passivity and Pit Stability Behavior of Copper as a Function of Selected Water Chemistry Variables

Passivity and Pit Stability Behavior of Copper as a Function of Selected Water Chemistry Variables

Three-dimensional micro-fabrication on copper and nickel

Inhibition of Copper Pitting Corrosion in Aggressive Potable Waters

Contact Info

Product

Resources

About