Three-dimensional micro-fabrication on copper and nickel

Jiang, Li-Min; Liu, Z.F.; Tang, Jing; Zhang, L.; Shi, Kang; Zhang, Tian; Liu, P.K.; Sun, Lining

doi:10.1016/j.jelechem.2004.11.041

Cited by 28 publications

(18 citation statements)

References 22 publications

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“…Experimental section. The machining can be achieved when the distance between electrode and workpiece is lower than a threshold value (Jiang et al, 2005;Shi et al, 2005;Zhang et al, 2006;Tang et al, 2007;Ma et al, 2007;Zhang et al, 2007). It can achieve etching pattens with high resolution, if the electrode and the workpiece remains relative rest.…”

Section: Experimental and Simulationsmentioning

confidence: 99%

Etching and smooth processing of GaAs surface based on the confined etchant layer technique

Cao

Guo

Yan

et al. 2017

IJNM

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Confined etchant layer technique (CELT) is an effective electrochemical etching method for micro-machining, which can be used to replicate complex three-dimensional microstructures and implement rough surface smooth processing. Through the coupling between electrochemically induced chemical etching processes and mechanical motion, a combination of high machining efficiency, low machining cost and good machining accuracy can be reached. In this paper, a CELT processing platform was established. By combining simulations with experiments, we studied the influence of the solution proportioning on the etching results of GaAs surface and verified the capacity of the CELT technique to achieve smooth processing. It is shown that by taking advantage of CELT, the surface roughness can reach nano-scale.Keywords: confined etchant layer technique; CELT; mechanical motion; smooth processing; simulation.Reference to this paper should be made as follows: Cao, Y., Guo, S., Yan, Y., Hu, Z., Zhao, X. and Li, Z. (2017)

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Section: Experimental and Simulationsmentioning

confidence: 99%

Etching and smooth processing of GaAs surface based on the confined etchant layer technique

Cao

Guo

Yan

et al. 2017

IJNM

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“…Although metals do not exhibit similar advantages as silicon concerning the functional properties, they are widely used in MEMS fabrication. Commonly used metals include gold, nickel, aluminium, stainless steel, copper, chromium, titanium, tungsten, platinum, and silver [1,[4][5][6][7][8]. This is because metals exhibit high strength, which minimises the possibility of experiencing major failures.…”

Section: Introductionmentioning

confidence: 99%

Manufacturing of metallic micro-components using hybrid soft lithography and micro-electrical discharge machining

Essa

Modica²,

Imbaby

et al. 2016

Int J Adv Manuf Technol

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In spite of significant improvements in micro-replication techniques, methods to fabricate well-defined net shape microstructures are still in a developing stage. Soft-lithography has the capability to manufacture complex micro-and nanostructures. Although it is considered a robust technique, a major limitation is related to the distortion encountered in the fabricated structures during the drying process. In the present work, a manufacturing technology has been developed that emerges the benefits of Soft-Lithography and Micro Electrical Discharge Machining (µ-EDM) to produce stainless steel precise micro-components for Microimplantable devices. The micro-parts produced by Soft-lithography were subsequently surface processed via µ-EDM in order to improve the surface quality. In addition to this, it was found that µ-EDM drastically improved the surface roughness of stainless steel microcomponents from Ra=3.4 µm to Ra =0.43 µm.

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“…In this paper we present an electrochemical bulk micromachining method named the confined etchant layer technique (CELT) [28][29][30][31][32] for micromachining titanium and its alloys. The fundamentals of CELT can be described as follows: The etchant is generated electrochemically on the surface of a machining tool or a mold with desired 3D microstructures.…”

Section: Introductionmentioning

confidence: 99%

“…The possible destruction and denaturalization of the intrinsic structure beneath the machining surface usually caused by highenergy beam machining can be avoided. In our laboratory the replication of complex 3D microstructures has been achieved on the surface of GaAs, Si, copper and nickel with a nano or sub-micro resolution [28][29][30][31].…”

Section: Introductionmentioning

confidence: 99%

A potential method for electrochemical micromachining of titanium alloy Ti6Al4V

Jiang

Attia

et al. 2008

J Appl Electrochem

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The micromachining of complex three-dimensional microstructures (bulk micromachining) on metals can be applied to fabricate many novel devices for micro electromechanical system (MEMS), which will greatly benefit the development of MEMS. In this paper, a new electrochemical micromachining method named the confined etchant layer technique (CELT) was explored on the micromachining of the titanium alloy. Micro-scale trapezoidal slots were replicated on titanium alloy by using a mold with the corresponding negative microstructures (trapezoidal teeth). The machining resolution reached 0.503 mu m. The electrochemical mechanisms involved in the process are analyzed and the parameters that influenced the machining resolution are discussed

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Three-dimensional micro-fabrication on copper and nickel

Cited by 28 publications

References 22 publications

Etching and smooth processing of GaAs surface based on the confined etchant layer technique

Etching and smooth processing of GaAs surface based on the confined etchant layer technique

Manufacturing of metallic micro-components using hybrid soft lithography and micro-electrical discharge machining

A potential method for electrochemical micromachining of titanium alloy Ti6Al4V

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