Inoculator dependent induced growth of α-Sn

Skwarek, Agata; Zachariasz, P.; Kulawik, J.; Witek, Krzysztof

doi:10.1016/j.matchemphys.2015.09.017

Cited by 13 publications

(19 citation statements)

References 12 publications

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“…However, with the recent global introduction of lead-free solders in the electronics industry to replace formerly used Sn-Pb alloys, the potential susceptibility to tin pest at low temperatures has attracted renewed vivid attention. The topic was re-investigated by several groups for typical tin-rich alloys used in electronic soldering applications with the goal of better understanding the factors influencing the start and spread of tin pest and its dependence on alloy components and impurities [5,8,[11][12][13][14][15][16][17][18].…”

Section: Introductionmentioning

confidence: 99%

Induction of tin pest for cleaning tin-drop contaminated optics

Böwering

2017

Materials Chemistry and Physics

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Highlights Tin pest induction leads to embrittlement of tin drops after β → α Sn transformation.  The purity grade influences the transformation speed of tin very strongly.  Tin drops on multilayer-coated optics disintegrate after β → α Sn transformation.  Tin drop contamination of optics is cleaned via phase transformation at -24 °C.  Reflectance of multilayer-coated mirrors is restored after tin drop transformation. Graphical Abstract AbstractTin pest, the allotropic β → α phase transformation of tin, was examined for use in cleaning of tin-contaminated optics. Induction of change in material structure led to disintegration of tin samples into pieces and powder. The transition times were studied for tin drops of different purity grades, using inoculation with α-Sn seed particles, also after prior mechanical deformation and surface oxide removal. For tin of very high purity levels fast nucleation within hours and full transformation within a day could be achieved during cooling at -24 °C, resulting in strong embrittlement of the material. Tin dripped onto samples of multilayer-coated optics as used in extreme ultraviolet lithography machines was made cleanable by phase transition after inoculation and cooling. The reflectance of multilayer-coated mirrors was found to decrease by no more than 1% with this cleaning method.

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Section: Introductionmentioning

confidence: 99%

Induction of tin pest for cleaning tin-drop contaminated optics

Böwering

2017

Materials Chemistry and Physics

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“…In our study, there was one order of magnitude grain size difference between the reference and the recrystallized samples (Figure 3). Taking into consideration that the samples used in the experiment were mechanically treated, which causes the grains to deform [30], the influence of Previously, the growth kinetics of the β-Sn to α-Sn transition was determined mainly by the impurities and/or alloying elements (e.g., Ag and Cu) in the Sn; the size of the β-Sn particles; the tin grain size; the temperature; and the thermomechanical history before the transformation [10,12,15,22,29]. In our study, there was one order of magnitude grain size difference between the reference and the recrystallized samples (Figure 3).…”

Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%

Effect of Recrystallization on β to α-Sn Allotropic Transition in 99.3Sn–0.7Cu wt. % Solder Alloy Inoculated with InSb

et al. 2020

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The effect of recrystallization of 99.3Sn–0.7Cu wt. % solder alloy on the allotropic transition of β to α-Sn (so-called tin pest phenomenon) was investigated. Bulk samples were prepared, and an InSb inoculator was mechanically applied to their surfaces to enhance the transition. Half of the samples were used as the reference material and the other half were annealed at 180 °C for 72 h, which caused the recrystallization of the alloy. The samples were stored at −10 and −20 °C. The β-Sn to α-Sn transition was monitored using electrical resistance measurements. The expansion and separation of the tin grains during the β-Sn to α-Sn transition process were studied using scanning electron microscopy. The recrystallization of the alloy suppressed the tin pest phenomenon considerably since it decreased the number of defects in the crystal structure where heterogeneous nucleation of β-Sn to α-Sn transition could occur. In the case of InSb inoculation, the spreading of the transition towards the bulk was as fast as the spreading parallel to the surface of the sample.

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“…The transition causes volume increase, which can lead to the decomposition of the samples [2]. Tin pest is an autocatalytic reaction, the appearance of α-Sn speeds up the transition [3]. Tin pest can occur in high tin content alloys as well [1,3] which are used in the microelectronics.…”

Section: Introductionmentioning

confidence: 99%

“…Tin pest is an autocatalytic reaction, the appearance of α-Sn speeds up the transition [3]. Tin pest can occur in high tin content alloys as well [1,3] which are used in the microelectronics. Some soluble elements in Sn can suppresses the transition (like Pb, Bi, Sb) some has the opposite effect (like Cd, Au) [4].…”

Section: Introductionmentioning

confidence: 99%

Electrical Characterization of β→α-Sn Transition in High Tin Content Solder Alloys with Different Inoculators

et al. 2019

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The identification of allotropic transition of the metallic β-Sn to non-metallic α-Sn in Sn-rich solders joints is crucial for electronics working in sub-zero temperatures. This phenomenon was characterized by electrical resistance measurements in SnCu1 and Sn99Ag0.3Cu0.7 alloys inoculated with InSb, CdTe and α-Sn. Samples were stored at −18 • C for 10 weeks. The transition showed characteristic differences at the different alloys and inoculators, like different nucleation, growth and the saturation stages. Although the presence of α-Sn initiates the transition faster than the other inoculators, but the higher diffusion rate of the non-tin inoculators results in much more serious destruction of the samples. The results of the electrical resistance measurements were validated with metallurgical cross-sections.

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Inoculator dependent induced growth of α-Sn

Cited by 13 publications

References 12 publications

Induction of tin pest for cleaning tin-drop contaminated optics

Induction of tin pest for cleaning tin-drop contaminated optics

Effect of Recrystallization on β to α-Sn Allotropic Transition in 99.3Sn–0.7Cu wt. % Solder Alloy Inoculated with InSb

Electrical Characterization of β→α-Sn Transition in High Tin Content Solder Alloys with Different Inoculators

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