Innovative Integration Based on Silicon-Core Technologies for Sensor and Communications Applications

Abstract

This paper describes an innovative system integration scheme wherein heterogeneous materials and devices, including photonic devices as well as electronics, are organically integrated on silicon-core circuitry to achieve better performance, higher functionality and lower cost. First, some general integration technology trends in semiconductor electronics are described. Then, after a discussion of new heterogeneous integration schemes based on silicon-core technologies, recent attempts and applications are shown such as low power LSIs, sensors and micromachine switches on silicon and millimeter-wave photonics. 205 Int. J. Hi. Spe. Ele. Syst. 2000.10:205-215. Downloaded from www.worldscientific.com by NANYANG TECHNOLOGICAL UNIVERSITY on 03/03/15. For personal use only.

<title>Gold damascene interconnect technology for millimeter-wave photonics on silicon</title>

“…3,7 The wave of technological fusion is indeed sweeping over RF applications and MMW photonics. [8][9][10] The development of RF and millimeter-wave integrated systems is now within the range of Si-core technologies 7,11 as the result of the introduction of high-speed Si-based devices like sub-0.1-µm LSIs 12 and SiGe ICs, 13,14 and the ability to combine compound semiconductors and Si by full-wafer wafer bonding. 15 Then, the key components in these high-and ultrahigh-speed systems -components such as antennas, filters, and transmission lines-need to be made on silicon connecting to such high speed active devices.…”