Ink-jet printing and camera flash sintering of silver tracks on different substrates

Yung, Kam Chuen; Gu, Xin; Lee, C. P.; Choy, H. S.

doi:10.1016/j.jmatprotec.2010.08.014

Cited by 81 publications

(43 citation statements)

References 6 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…[ 73 ] Other techniques for sintering printed metal NPs involve the use of argon plasma, microwaves, and various light sources (IR-UV). [74][75][76][77][78] While the use of a laser enables selective heating and patterning of the printed areas on the substrate by sintering or ablation, the process is not suitable for larger areas. [ 76 ] H.-S. Kim et al used a xenon fl ash lamp for sintering a micrometer-thick fi lm of copper (Cu) NPs and achieved a volume resistivity as low as 5 μ Ω cm after exposure to a 2 ms light pulse (intensity of up to 25 kW cm − 2 ).…”

Section: Metalsmentioning

confidence: 99%

“…Yung et al used a different fl ash lamp setup for sintering inkjetted Ag NPs on plastics and photopaper. [ 78 ] The use of a light source for sintering printed NPs is especially suitable on paper because the substrate has a high diffuse refl ectance and a low thermal conductivity ( ≈ 0.05 W m − 1 K − 1 ). An incandescent light source, which is more inexpensive than a fl ash lamp has also been used for sintering inkjetted Ag NPs on paper.…”

Section: Metalsmentioning

confidence: 99%

See 1 more Smart Citation

Paper Electronics

Tobjörk¹,

Österbacka²

2011

Advanced Materials

1,187

1,040

View full text Add to dashboard Cite

Paper is ubiquitous in everyday life and a truly low-cost substrate. The use of paper substrates could be extended even further, if electronic applications would be applied next to or below the printed graphics. However, applying electronics on paper is challenging. The paper surface is not only very rough compared to plastics, but is also porous. While this is detrimental for most electronic devices manufactured directly onto paper substrates, there are also approaches that are compatible with the rough and absorptive paper surface. In this review, recent advances and possibilities of these approaches are evaluated and the limitations of paper electronics are discussed.

show abstract

Section: Metalsmentioning

confidence: 99%

Section: Metalsmentioning

confidence: 99%

Paper Electronics

Tobjörk¹,

Österbacka²

2011

Advanced Materials

1,187

1,040

View full text Add to dashboard Cite

show abstract

“…Recently, the use of a tungsten 40,177 or xenon 178,179 lamp was demonstrated in fabricating large area conductive electrodes or thin films on paper and plastic substrates. Camera flash has also been used as light source to sinter Ag NP tracks 180,181 or reduce the sheet resistance of Ag NW electrodes for foldable paper electronic 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 42 application 182 . Garnett et al 40 explained this as a self-limited plasmonic welding method to create nanojunctions of Ag NWs, as shown in Figure 16 a-c.…”

Section: Optical Welding: Localized Plasmonic Heatingmentioning

confidence: 99%

Joining of Silver Nanomaterials at Low Temperatures: Processes, Properties, and Applications

Peng¹,

Gerlich³

et al. 2015

ACS Appl. Mater. Interfaces

294

121

View full text Add to dashboard Cite

A review is provided, which first considers low-temperature diffusion bonding with silver nanomaterials as filler materials via thermal sintering for microelectronic applications, and then other recent innovations in low-temperature joining are discussed. The theoretical background and transition of applications from micro to nanoparticle (NP) pastes based on joining using silver filler materials and nanojoining mechanisms are elucidated. The mechanical and electrical properties of sintered silver nanomaterial joints at low temperatures are discussed in terms of the key influencing factors, such as porosity and coverage of substrates, parameters for the sintering processes, and the size and shape of nanomaterials. Further, the use of sintered silver nanomaterials for printable electronics and as robust surface-enhanced Raman spectroscopy substrates by exploiting their optical properties is also considered. Other low-temperature nanojoining strategies such as optical welding of silver nanowires (NWs) through a plasmonic heating effect by visible light irradiation, ultrafast laser nanojoining, and ion-activated joining of silver NPs using ionic solvents are also summarized. In addition, pressure-driven joining of silver NWs with large plastic deformation and self-joining of gold or silver NWs via oriented attachment of clean and activated surfaces are summarized. Finally, at the end of this review, the future outlook for joining applications with silver nanomaterials is explored.

show abstract

“…This represents a significant drawback in implementation of large-area production of printed electronics, being unfavorable in terms of cost. Moreover, to avoid such interference with the thermal properties of the polymer, sintering with microwave heating, 17 Ar plasma, 18,19 ultraviolet (UV) irradiation, 20 and flash light irradiation [21][22][23][24][25][26] have been considered as alternatives. Furthermore, the long sintering time of 30 min or more that is generally required to create conductive features also hinders industrial implementation.…”

Section: Introductionmentioning

confidence: 99%

Laser Direct Writing of Conductive Silver Micropatterns on Transparent Flexible Double-Decker-Shaped Polysilsesquioxane Film Using Silver Nanoparticle Ink

Aminuzzaman

Watanabe

Miyashita

2015

Journal of Elec Materi

View full text Add to dashboard Cite

This paper describes fabrication of conductive, highly adhesive silver (Ag) micropatterns on transparent flexible double-decker-shaped polysilsesquioxane (DDPSQ) film by a laser direct writing technique using a precursor film prepared from liquid-dispersed Ag nanoparticles. The laser-written Ag micropatterns have been characterized by optical microscopy, field-emission scanning electron microscopy, surface profilometry, and resistivity measurements. The line width of the Ag micropatterns can be flexibly controlled by changing the objective lens magnification and laser spot size. Using a 9100 objective lens and laser energy density of 170.50 kW/cm 2 , Ag micropatterns with line width of about 4 lm have been achieved. The Ag micropatterns show excellent adherence to the DDPSQ surface as evaluated by Scotch-tape test. The resistivity of the Ag micropatterns has been determined to be 4.1 9 10 À6 X cm using the two-point probe method, being almost comparable to that of bulk Ag (1.6 9 10 À6 X cm). Thus, high-quality, narrow, homogeneous Ag microlines with high conductivity and adhesion can be produced under optimized laser scanning conditions.

show abstract

Ink-jet printing and camera flash sintering of silver tracks on different substrates

Cited by 81 publications

References 6 publications

Paper Electronics

Paper Electronics

Joining of Silver Nanomaterials at Low Temperatures: Processes, Properties, and Applications

Laser Direct Writing of Conductive Silver Micropatterns on Transparent Flexible Double-Decker-Shaped Polysilsesquioxane Film Using Silver Nanoparticle Ink

Contact Info

Product

Resources

About