2014
DOI: 10.1063/1.4897342
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InGaN/GaN tunnel junctions for hole injection in GaN light emitting diodes

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Cited by 66 publications
(53 citation statements)
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“…Our TJ design allowed us to achieve a differential resistivity lower than 10 −4 Ω·cm 2 for current densities higher than 2 kA=cm 2 , which is very promising for LD applications and is one of the best results among those reported in the literature. 4,8,23,29) An interesting remark can be given from the comparison of the differential resistivities of the standard LD, TJ LD, and test TJ n=p ++ =n ++ structure. Figure 4 shows the differential resistivities of the standard PAMBE and TJ LDs (the I-V characteristics of which are depicted in Fig.…”
mentioning
confidence: 99%
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“…Our TJ design allowed us to achieve a differential resistivity lower than 10 −4 Ω·cm 2 for current densities higher than 2 kA=cm 2 , which is very promising for LD applications and is one of the best results among those reported in the literature. 4,8,23,29) An interesting remark can be given from the comparison of the differential resistivities of the standard LD, TJ LD, and test TJ n=p ++ =n ++ structure. Figure 4 shows the differential resistivities of the standard PAMBE and TJ LDs (the I-V characteristics of which are depicted in Fig.…”
mentioning
confidence: 99%
“…However, recent reports have shown that by exploiting the strong internal piezoelectric fields present in nitride heterostructures, it is possible to reduce the depletion width of the p-n junction and achieve the strong tunneling of carriers through such a structure. 22,23) For example, by inserting an InGaN well into the p-n junction region, it is possible to reduce the specific resistance of the junction to 10 −4 Ω·cm. 2,4) It was also demonstrated that by introducing GdN nanoislands, the tunneling through the midgap states inside the TJ was enhanced.…”
mentioning
confidence: 99%
“…55 There are two primary methods for overcoming these issues: (1) activate the p-GaN using a side-wall activation method, 55 or (2) growth of the n-type TJ layers using molecular-beam epitaxy (MBE). 27,48,[56][57][58][59][60] Sidewall activation has been demonstrated, however it shows limitations in activating large-area devices (300 µm × 300 µm mesa size). 55 Because VCSELs are very small devices (≤ 100 µm × ≤ 100 µm mesa size), it seems quite plausible that side-wall activation could be used to make high quality III-nitride TJ intracavity contacts for VCSELs using MOCVD, which would greatly simplify the processing and growth procedure, compared to the MOCVD-MBE TJ VCSEL method.…”
Section: Overview Of Iii-nitride Tunnel Junctionsmentioning
confidence: 99%
“…The MOCVD-MBE approach has also faced some challenges in achieving high quality TJs. To overcome this, researchers have inserted AlN, 56 InGaN, 57,58 or GdN nanoisland 59 layers between the p-GaN and n-GaN TJ layers, which have improved tunneling. The AlN and InGaN interlayers, in particular, leverage the polarization fields present in the c- Figure 1 (color online) Refractive index and absorption coefficient dispersion for multi-layer ITO films used in some of UCSB's III-nitride VCSELs with ITO intracavity contacts.…”
Section: Overview Of Iii-nitride Tunnel Junctionsmentioning
confidence: 99%
“…Since the important inventions mainly by Nakamura, Akasaki, and Amano in the development of GaN-based light-emitting diodes (LEDs) (they received Nobel Prize in Physics for the invention of blue LED in 2014) [3][4][5], these devices were widely investigated to enhance the external quantum efficiency and optical power as well as to reduce the electrical injection issues [6,7]. GaN-based LEDs are mostly grown with metalorganic chemical vapor deposition (MOCVD) on c-plane sapphire substrates.…”
Section: Color-converter Qds On Gan-based Devicesmentioning
confidence: 99%