Infrared and liquid chromatographic characterization of epoxy cresol novolac‐phenol formaldehyde novolac‐tertiary amine resin systems

Abstract

SynopsisThe subject of this paper is an infrared and liquid chromatographic characterization of epoxy molding compounds of importance in the microelectronic manufacturing industry. A complete infrared description of resin extracts from 4000 to 700 cm-l is given for three nondisclosed commercial extracts via comparisons with model epoxy cresol novolac and phenol formaldehyde novolac resins and by observing those spectral alterations affected during cure. In addition, both the molecular weight distributions and the methodology of obtaining such for the resin and hardener components of the extracts are described. These results are based upon reversed phase liquid chromatography and infrared spectroscopic measurements. The analysis described in this paper demonstrates significant differences among materials that, by chromatography alone, appear to have only subtle variations in both the resin and hardener molecular weight distributions. These differences include not only the quantity of resin or hardener of a particular oligomeric molecular weight, but also the apparent resin-to-hardener stoichiometry of the combined system.

Cure monitoring via different techniques: Isothermal cure of an epoxy-novolac molding compound

“…These are assigned to aryl ether, aryl-alkyl ether, phenol, and epoxide groups, respectively. The present assignments are in general agreement (except the peculiar feature of the 1636 cm j peak) with those of Belton and Sullivan [17] in their infrared study ofepoxy-novolac resins from different sources.…”

Thermal degradation of epoxy novolac‐phenol formaldehyde novolac resin systems

“…7 The reaction is an addition reaction, not a condensation reaction. Therefore, the products generated in these outgassing experiments are assumed to be low molecular weight species or degradation products.…”

“…In the curing reaction of the ECN-PFN systems, the epoxy resin reacts with a novolac resin to form a three-dimensional network as shown in Figure l. 7 The reaction is an addition reaction, not a condensation reaction. Therefore, the products generated in these outgassing experiments are assumed to be low molecular weight species or degradation products.…”

Low Temperature Curable Photo-sensitive Insulator

“…Generally, the phenolic resin has been known to perform well for printed circuit boards (PCB) because of its good insulation, good heat resistance and more. In addition, our photo-sensitive insulator was composed of epoxy compounds for cross-linking with the phenolic resin, naphthoquinone diazide (DNQ) compounds and additives [14][15]. Regarding lithography performance, DNQ compounds contained as photo-initiators work for positive-tone resists and decompose with UV light as the following reaction scheme shows in Figure 1.…”