2020 IEEE 70th Electronic Components and Technology Conference (ECTC) 2020
DOI: 10.1109/ectc32862.2020.00013
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InFO_SoW (System-on-Wafer) for High Performance Computing

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Cited by 21 publications
(2 citation statements)
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“…Žå-Ý •IþäkãOE nÜ`³. È>32020cJÑ InFO SoW £Integrated Fan-Out of System-on-Wafer¤ Eâ´‚ [74] , Teslaae^TEâ´‚íÑ ¬ ? ¡ ¬Dojo [75] .Tesla3˜¡12=€¬ þÜÝ 25¡D1 ¡,z¬ ¡OEé Jø4TB/s êâ'°, ‡¬ é êâ'°OEˆ36TB/s,ùƒ'uNVIDIA•# GPU ¡H100 ¡ êâ'°900GB/sJ , 40 ; 3Žå-Ý ¡,ò120 ‡¬ ?…”
Section: 35unclassified
“…Žå-Ý •IþäkãOE nÜ`³. È>32020cJÑ InFO SoW £Integrated Fan-Out of System-on-Wafer¤ Eâ´‚ [74] , Teslaae^TEâ´‚íÑ ¬ ? ¡ ¬Dojo [75] .Tesla3˜¡12=€¬ þÜÝ 25¡D1 ¡,z¬ ¡OEé Jø4TB/s êâ'°, ‡¬ é êâ'°OEˆ36TB/s,ùƒ'uNVIDIA•# GPU ¡H100 ¡ êâ'°900GB/sJ , 40 ; 3Žå-Ý ¡,ò120 ‡¬ ?…”
Section: 35unclassified
“…The lower roughness and smaller line spacing for the Chiplet connection can be achieved by InFO_SoW technology. The bandwidth density and power distribution network (PDN) impedance are 2× and 30% more than flip-chip multi-chip-module (MCM) interconnection, and interconnection power consumption is reduced by 15% [23], as shown in Figure 3c. In Agilex series FPGAs, the core Chiplet and other Chiplets were interconnected using Embedded Multidie Interconnect Bridge (EMIB).…”
Section: Computing Architecture Integrated With 25d Technologymentioning
confidence: 99%