The channel/gate length of transistors is getting close to the physical limit. [1] To meet the requirements of chip performance, advanced design technologies are utilized to bring higher Transistors are getting close to their physical limitation, and complex chip design technologies have made the hotspot problem more serious. Graphene and hBN, as representative 2D semi-metal and dielectric materials, possess excellent thermal conductivities. Intrinsic 2D materials, 2D film materials, and 2D composite materials have been investigated, showing great potential for next-generation thermal-management materials. There are products that have already been commercialized based on graphene and hBN, but many companies seem to be sitting on the fence, and the obstacles toward implementation of these materials need to be specified. Here, high thermal conductivity 2D materials from theory and engineering to applications are reviewed, aiming to provide a comprehensive summary of the current state of the art of this field in order to give an overview and future prospects in application, manufacturing, and commercialization. From the theoretical perspective, the impact factors and development path of 2D materials for thermal dissipation and the engineering aspect of structural design are presented. The prospects and challenges are also tackled, expressing an objective view about future opportunities to build 2D-based heat-dissipation systems.
Computing systems are widely used in medical diagnosis, climate prediction, autonomous vehicles, etc. As the key part of electronics, the performance of computing systems is crucial in the intellectualization of the equipment. The conflict between performance, efficiency, and cost can be solved by choosing an appropriate computing system architecture. In order to provide useful advice and instructions for the designers to fabricate high-performance computing systems, this paper reviews the Chiplet-based computing system architectures, including computing architecture and memory architecture. Firstly, the computing architecture used for high-performance computing, mobile, and PC is presented and summarized. Secondly, the memory architecture based on mainstream memory and emerging non-volatile memory used for data storing and processing are introduced, and the key parameters of memory are compared and discussed. Finally, this paper is concluded, and the future perspectives of computing system architecture based on Chiplet are presented.
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