Influences of specimen size and deformation mode on the strength of single-crystal silicon micro-beam structures

Yamagiwa, H.; Fujii, Tatsuya; Namazu, Takahiro; Saito, Misako; Yamada, Kazutoyo; Miyatake, Takashi

doi:10.1109/memsys.2012.6170221

Cited by 8 publications

(12 citation statements)

References 4 publications

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“…5 by SCFs. The revised graph shows no deformation-mode dependence [3]. This fact means that uniaxial tension test results can be directly used for the design of MEMS structures showing torsion or bending deformation.…”

Section: Introductionmentioning

confidence: 93%

“…Figure 5 shows the Weibull plot of the strength estimated under the assumption that the specimens have ideal flat sidewalls. The Weibull plot of all the strength data including bending mode data showed that there are both deformation mode and specimen size dependences [3]. Because all the actual specimens tested have scalloping sidewalls, stress concentration definitely occurs.…”

Section: Introductionmentioning

confidence: 97%

“…In MEMS 2012, we reported torsion-bending combined strength test of microscale single crystal silicon (SCS) beam specimens [3]. The equipment, however, could not apply tension to a specimen.…”

Section: Introductionmentioning

confidence: 99%

“…Figure 1 shows a schematic of the principle for tension-torsion-bending combined loading test. The shape of a specimen was designed in consideration of typical optical MEMS devices including a mirror plate supported by two doubly-clamped torsion beams [3,4]. In pure torsion loading, the mirror plate is somewhat loosely sandwiched by two plate jigs that play a role as a rotation support under the situation that two frames located at both specimen ends are fixed onto two sample stages.…”

Section: Introductionmentioning

confidence: 99%

“…Because all the actual specimens tested have scalloping sidewalls, stress concentration definitely occurs. Stress concentration factors (SCFs) for respective deformation-modes specimens were estimated by FEAs based on AFM and SEM observation results [3]. Figure 6 shows the revised Weibull plot of the revised strength data calculated by multiplying raw strength data shown in Fig.…”

Section: Introductionmentioning

confidence: 99%

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Tension-torsion-bending combined loading test technique for the reliability of MEMS structures

Fujii

Yamagiwa

Inoue

et al. 2013

2013 Transducers &Amp; Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems

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In this paper, tension-torsion-bending combined loading test technique for microscale single crystal silicon beam specimens is described. We have designed and developed two types of the multi-deformation loading test apparatuses to investigate the deformation-mode and specimen-size dependencies on the fracture strength. The comparisons among the strength data under different deformation-modes and different sizes were made using the Weibull statistics. Both of the size effect and the deformation-mode effect were apparently found when all the strength data were calculated based on the assumption that the specimens had ideal flat sidewalls. Stress concentration factors (SCFs) in each specimen were estimated using scanning electron microscopy observation and finite element analysis. After re-calculation of all the strength data in consideration of the SCFs, the Weibull distribution showed no deformation-mode effect though size effect still remained.

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Section: Introductionmentioning

confidence: 93%

Section: Introductionmentioning

confidence: 97%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations

Tension-torsion-bending combined loading test technique for the reliability of MEMS structures

Fujii

Yamagiwa

Inoue

et al. 2013

2013 Transducers &Amp; Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems

Self Cite

View full text Add to dashboard Cite

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Mechanical Property Measurement of Micro/Nanoscale Materials for MEMS: A Review

Namazu

2022

IEEJ Transactions Elec Engng

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By virtue of a great progress of semiconductor fabrication technologies, micro electro‐mechanical systems (MEMS) have been developed for a wide variety of industries. For reliability of MEMS, micromaterials in MEMS need to be examined experimentally, and the obtained results need to be reflected in the design of MEMS. In addition, with the benefit of such the MEMS technology, nowadays mechanical characteristics of nanomaterials have been evaluated precisely. Nanoscale mechanical testing provides an opportunity to find new unique physical phenomena, such as plastic deformation in Si at intermediate temperatures. In this review paper, mechanical testing technologies developed for investigating micro and nanoscale materials are reviewed. Then, mechanical characteristics of Si and other materials evaluated using the micro and nano mechanical testing technologies are introduced. © 2022 Institute of Electrical Engineers of Japan. Published by Wiley Periodicals LLC.

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On‐chip test method for in‐situ evaluating the impact resistance reliability of silicon microbeams

Cheng

Zhang

2020

Micro & Nano Letters

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To the best of the authors' knowledge, this Letter reports and validates for the first time an on-chip reseTable test method that can be used to in-situ evaluate the impact reliability of a process-related silicon microbeam. A test structure integrating impact generating device, test samples, and a lock module is proposed to evaluate the impact-resistant reliability of the process-related microbeam samples with only a common optical microscope and probe station in the fabrication line. A calculation model that uses the LS-Dyna module in the finite-element commercial software ANSYS to process the test results is proposed to obtain the numerical parameters of the impact resistance reliability of the microbeam specimen. The test structure can be manufactured using a variety of mainstream MEMS silicon processes, so it can characterise the impact reliability of silicon microbeam structures under various processes. The above three parts constitute a self-aligned, low-cost test method with automation potential, which can be used for large-scale characterisation of the impact resistance reliability of silicon microbeam structures on the fabrication line. Finally, beam specimens under three different process conditions were manufactured and successfully evaluated using this test method, which verified the rationality of this method.

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Influences of specimen size and deformation mode on the strength of single-crystal silicon micro-beam structures

Cited by 8 publications

References 4 publications

Tension-torsion-bending combined loading test technique for the reliability of MEMS structures

Tension-torsion-bending combined loading test technique for the reliability of MEMS structures

Mechanical Property Measurement of Micro/Nanoscale Materials for MEMS: A Review

On‐chip test method for in‐situ evaluating the impact resistance reliability of silicon microbeams

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