Influences of Laser Welding Parameters on Mechanical Properties of Polymethyl Methacrylate and Stainless-Steel Joints

Yijie, 黄怡洁 Huang; Xiangdong, 高向东 Gao; Shaoduo, 林少铎 Lin

doi:10.3788/cjl201744.1202006

Cited by 1 publication

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“…Because the sealing temperature of the solder is not enough, the pores cannot overflow from the melting layer, and the viscosity of the solder decreases, which leads to a large number of blocky structures. Due to the improper laser sealing conditions, the pores are easy to appear in the sealing layer [21], and the particles centered on the pores extend outwards in the form of emission, so the micro cracks with different growth degrees are formed, and the overall extension ability of the cracks is very strong. When the solder particles are smaller but the particles are scattered unevenly or agglomerated, it will also form a large stress concentration in the micro area, and even produce micro crack defects.…”

Section: Formation Mechanism Of Pores In Vacuum Glass Sealing Layer Bmentioning

confidence: 99%

Laser Sealing for Vacuum Plate Glass with PbO-TiO2-SiO2-RxOy Solder

et al. 2020

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Laser sealing for vacuum plate glass is a key step in developing the cost-effective smart vacuum-glass window for the drive towards net-zero energy buildings. In this paper, the pores, cracks, and interface with laser welding are analyzed in depth using PbO-TiO2-SiO2-RxOy system sealing solder to prepare vacuum flat glass. The microstructure of the sealing layer was analyzed by a BX41M-LED metallographic microscope, and the interfacial bonding characteristics were observed by thermal field emission scanning electron microscopy (SEM). The solder was analyzed by an energy spectrometer, and the influence of laser power, sealing temperature, and sealing speed on the gas holes and the crack sand interface separation of the sealing layer are reported. The results show that when the laser power reached 80 W at the welding speed of 2 mm/s, the bulk solder disappeared to most of the quantity and the sealing surface density was higher, due to which negligible pores and micro cracks were found. Thus, the sealing quality of the sealing layer is considered to be suitable when the temperature of 470 °C was maintained and the solder has 68.93% of Pb and 3.04% Si in the atom fraction to achieve the wet the glass substrate surface whilst improving the bonding quality.

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Section: Formation Mechanism Of Pores In Vacuum Glass Sealing Layer Bmentioning

confidence: 99%