Influence of the wafer chuck on integrated antenna measurements

Abstract

For meaningful pattern measurements of integrated antennas the devices, which are required during the measurement process, need to be optimized to influence the measurement results as little as possible. In this paper the errors caused by reflections on the chuck are investigated and quantified. A plastic chuck was built to reduce sources of reflection and thus improve the overall accuracy of the setup. The new chuck causes less ripples over the scanning angle and over the frequency and therefore, increases the performance of the setup significantly.