Influence of the trapezoidal cross-section of single and coupled inverted embedded microstrip lines on signal integrity

Ginste, Dries Vande; Zutter, D. De

doi:10.1109/ursigass.2011.6050753

Cited by 4 publications

(4 citation statements)

References 5 publications

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“…We determine the elements of the 2 × 2 p.u.l. parameter matrices R, L, G and C, comparing the results of our proposed approach to the reference [25], which invokes a DtN formalism for rectangles, in Figs. 4 and 5.…”

Section: A Inverted Embedded Microstrip Linesmentioning

confidence: 99%

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Efficient Characterization of Interconnects with Arbitrary Polygonal Cross-sections using Fokas-derived Dirichlet-to-Neumann Operators

Ginste¹

2023

Preprint

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<p>A novel technique to accurately characterize interconnects with general, piecewise homogeneous material parameters and arbitrary polygonal cross-sections is presented. To compute the per-unit-of-length complex inductance and capacitance matrices of the considered structures, we apply a boundary integral equation framework, invoking a Dirichlet-to-Neumann formalism to recast the problem at hand. The pertinent operators are constructed by means of the numerically fast Fokas method. Numerical examples of various multiconductor transmission lines demonstrate that our proposed scheme is flexible and precise. Since our method is not limited to rectangular cross-sections, manufacturing effects such as etching can also be taken into account. Moreover, the examples are not restricted to RLGC-data as we also consider signal attenuation, slow-wave factors and cross-talk.</p>

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Section: A Inverted Embedded Microstrip Linesmentioning

confidence: 99%

“…An excellent agreement is observed. As is done in [25], we consider the SiO 2 as the background medium. The remaining components are discretized with segments of length ≈ 0.5 µm, amounting to a total of 964 unknowns.…”

Section: A Inverted Embedded Microstrip Linesmentioning

confidence: 99%

Efficient Characterization of Interconnects with Arbitrary Polygonal Cross-sections using Fokas-derived Dirichlet-to-Neumann Operators

Ginste¹

2023

Preprint

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“…We determine the elements of the 2 × 2 p.u.l. parameter matrices R, L, G and C, comparing the results of our proposed approach to the reference [30], which invokes a DtN formalism for rectangles, in Figs. 4 and 5.…”

Section: A Inverted Embedded Microstrip Linesmentioning

confidence: 99%

“…An excellent agreement is observed. As is done in [30], we consider the SiO 2 as the background medium. The remaining components are discretized with segments of length ≈ 0.5 µm, amounting to a total of 964 unknowns.…”

Section: A Inverted Embedded Microstrip Linesmentioning

confidence: 99%

Efficient Characterization of Interconnects With Arbitrary Polygonal Cross Sections Using Fokas-Derived Dirichlet-to-Neumann Operators

Bosman,

Huynen,

De Zutter

et al. 2023

IEEE Trans. Compon., Packag. Manufact. Technol.

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A novel technique to accurately characterize interconnects with general, piecewise homogeneous material parameters and arbitrary polygonal cross-sections is presented. To compute the per-unit-of-length complex inductance and capacitance matrices of the considered structures, we apply a boundary integral equation framework, invoking a Dirichletto-Neumann formalism to recast the problem at hand. The pertinent operators are constructed by means of the numerically fast Fokas method, leveraging fully analytical expressions for the pertinent matrix elements. Numerical examples of various multiconductor transmission lines demonstrate that our proposed scheme is flexible and precise. Since our method is not limited to rectangular cross-sections, manufacturing effects such as etching can also be taken into account. Moreover, the examples are not restricted to RLGC-data as we also consider signal attenuation, slow-wave factors and cross-talk.

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Time-Domain Green's Function-Based Parametric Sensitivity Analysis of Multiconductor Transmission Lines

Spina

Ferranti

Antonini

et al. 2012

IEEE Trans. Compon., Packag. Manufact. Technol.

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Abstract-We present a new parametric macromodeling technique for lossy and dispersive multiconductor transmission lines. This technique can handle multiple design parameters, such as substrate or geometrical layout features, and provide timedomain sensitivity information for voltages and currents at the ports of the lines. It is derived from the dyadic Green's function of the 1-D wave propagation problem. The rational nature of the Green's function permits the generation of a timedomain macromodel for the computation of transient voltage and current sensitivities with respect to both electrical and physical parameters, completely avoiding similarity transformation, and it is suited to generate state-space models and synthesize equivalent circuits, which can be easily embedded into conventional SPICElike solvers. Parametric macromodels that provide sensitivity information are well suited for design space exploration, design optimization, and crosstalk analysis. Two numerical examples validate the proposed approach in both frequency and timedomain.

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Influence of the trapezoidal cross-section of single and coupled inverted embedded microstrip lines on signal integrity

Cited by 4 publications

References 5 publications

Efficient Characterization of Interconnects with Arbitrary Polygonal Cross-sections using Fokas-derived Dirichlet-to-Neumann Operators

Efficient Characterization of Interconnects with Arbitrary Polygonal Cross-sections using Fokas-derived Dirichlet-to-Neumann Operators

Efficient Characterization of Interconnects With Arbitrary Polygonal Cross Sections Using Fokas-Derived Dirichlet-to-Neumann Operators

Time-Domain Green's Function-Based Parametric Sensitivity Analysis of Multiconductor Transmission Lines

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