Influence of the layer thickness in plasmonic gold nanoparticles produced by thermal evaporation

Abstract

Metallic nanoparticles (NPs) have received recently considerable interest of photonic and photovoltaic communities. In this work, we report the optoelectronic properties of gold NPs (Au-NPs) obtained by depositing very thin gold layers on glass substrates through thermal evaporation electron-beam assisted process. The effect of mass thickness of the layer was evaluated. The polycrystalline Au-NPs, with grain sizes of 14 and 19 nm tend to be elongated in one direction as the mass thickness increase. A 2 nm layer deposited at 250°C led to the formation of Au-NPs with 10-20 nm average size, obtained by SEM images, while for a 5 nm layer the wide size elongates from 25 to 150 nm with a mean at 75 nm. In the near infrared region was observed an absorption enhancement of amorphous silicon films deposited onto the Au-NPs layers with a corresponding increase in the PL peak for the same wavelength region.

Novel Highly Sensitive Protein Sensors Based on Tapered Optical Fibres Modified with Au-Based Nanocoatings

“…The broad decrease in transmission in the 550 nm−700 nm region is believed to be a result of a plasmon peak of the Au film. These results correspond well to the previously published data [37,38].…”

“…In the case of the sputtering, the highly uniform film can be obtained [37,38], while the attachment of the Au NPs to the SiO 2 mesoporous thin film results in the film structure that does not suppress the coupling of the higher order modes and thus retains the fringes in the transmission spectrum. The further work is required to understand this difference in more detail.…”

Printing a Self‐Reducing Copper Precursor on 2D and 3D Objects to Yield Copper Patterns with 50% Copper's Bulk Conductivity

“…These observations correlate well with morphologies of thin metal fi lms obtained by sputtering [ 24 ] or thermal evaporation processes. [ 25 ] The effect of the distance between the two substrates on the transferred copper thickness is presented in Figure 3 . It was found that as the distance decreases, a thicker copper layer is transferred to the acceptor substrate, while the thickest layer was obtained without a gap.…”

Growth of gold nanoparticles using aluminum template via low-temperature hydrothermal method for memory applications

“…Therefore, efficient approaches of AuNP formation on substrates are necessary to achieve excellent NP distribution. For instance, self-assembled monolayers (SAMs), physical vapor deposition, and Langmuir-Blodgett method [6][7][8][9][10][11][12] have been developed to produce AuNPs on substrates.…”

“…Physical vapor deposition can be used to produce AuNPs by depositing a layer of gold thin films followed by post-deposition annealing to acquire agglomerated AuNPs via the Ostwald ripening method [11]. However, diffusion of metals to form an interface layer and stacking of structures may degrade the memory properties of devices.…”