Influence of the incidence angie on iron and copper surface microtopography induced by ion bombardment

Analytical modelling of sputter induced surface morphology

“…(24). The second of the two features indicates that when diffusion processes obtain, any instantaneous stage of surface development is not only ion erosion fluence dependent, but will be time and thus ion 'flux dependent because of the diffusion processes.…”

Oblique incidence sputtering of triangular microprofiles

“…(12) for normal incidence and symmetric profiles has been tested in a previous work. 5 Some experimental observations of drastic modifications of surface sputtered microtopography by slight changes of incidence plane or incidence angle reported by Gvosdover et ul." and Elich et ul."…”

Theoretical assessments of major physical processes involved in the depth resolution in sputter profiling

“…There is experimental evidence for such processes. 28 Erlenwein and Hofmann27 adopted this premise and suggested that interaction of atoms in exposed surfaces planes with vacant atomic sites in the next deeper plane would result in a smoothing action and thus inhibit the effective differential topography growth of the Benninghoven-Hofmann314 model. Erlenwein and Hofmann27 assumed that this exchange reaction was proportional to the product of the density of exposed plane atoms, Bi, and the density of the next plane vacancies (1 -&+I).…”