2017
DOI: 10.1134/s1063782617020178
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Influence of the doping type and level on the morphology of porous Si formed by galvanic etching

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Cited by 6 publications
(4 citation statements)
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“…Tang D. and co-authors showed that porosity of cathode diffusion layer has a significant effect on the oxygen mass transfer and removal of liquid water in direct ethanol fuel cell [15]. The porosity and specific surface area of porous silicon depend on a few parameters: the type of conductivity and resistivity of the silicon wafer [16,17], the composition and temperature of the electrolyte for etching [18,19], the illumination of the reaction zone [20,21] and metal composition deposed on Si [22]. The influence of these parameters is intensively studied.…”
Section: Introductionmentioning
confidence: 99%
“…Tang D. and co-authors showed that porosity of cathode diffusion layer has a significant effect on the oxygen mass transfer and removal of liquid water in direct ethanol fuel cell [15]. The porosity and specific surface area of porous silicon depend on a few parameters: the type of conductivity and resistivity of the silicon wafer [16,17], the composition and temperature of the electrolyte for etching [18,19], the illumination of the reaction zone [20,21] and metal composition deposed on Si [22]. The influence of these parameters is intensively studied.…”
Section: Introductionmentioning
confidence: 99%
“…Porous silicon (por-Si) has been receiving a great deal of attention due to its interesting physical and optical [1] properties and promising potential technological applications in the fields of sensing [2,3], Li-ion batteries [4], and solar cells [5]. The morphology of the silicon wafer may be modified by electrochemical wet etching [6][7][8], galvanic etching [9][10][11], or metal-assisted chemical etching (MACE) [12,13] to produce pores, nanowires, and microstructures. These methods have already been studied in detail.…”
Section: Introductionmentioning
confidence: 99%
“…The physical properties of porous silicon are determined by two large groups of factors that affect carrier density on the surface. The first group of factors includes doping type and charge carrier concentration [10,14]. The second group includes illumination during etching [15,16].…”
Section: Introductionmentioning
confidence: 99%
“…Anodization of silicon in hydrofluoric acid solution is considered the best technique to form homogeneous porous structures reproducibly, although other methods have also been reported, such as stain etching [15], galvanic etching [16], metal-assisted chemical etching [17,18], and contactless electrochemical etching [19]. In the anodization process, semiconductor silicon with defect electrons (e − ) or holes (h + ) is dissolved to form pores orthogonal to the Si surface ( Figure 1) [20].…”
Section: Fabrication Of Porous Siliconmentioning
confidence: 99%