2011
DOI: 10.1016/j.egypro.2011.06.178
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Influence of the dopant on the contact formation to p+-type silicon

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Cited by 11 publications
(11 citation statements)
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“…2(a) identifies an area where Si and bulk Ag conductor line (sintered Ag particles) appears to be "touching." These ultrathin interfacial glass with nano-Ag colloids regions of FS contact of p-type Si cells were in detail investigated and previously reported [8]- [10], [12]- [14]. The microstructures revealed by our SEM images of these n-type Si cell contacts are consistent with our previously proposed conduction model using nano-Ag colloids-assisted tunneling [14]- [16].…”
Section: Resultssupporting
confidence: 88%
“…2(a) identifies an area where Si and bulk Ag conductor line (sintered Ag particles) appears to be "touching." These ultrathin interfacial glass with nano-Ag colloids regions of FS contact of p-type Si cells were in detail investigated and previously reported [8]- [10], [12]- [14]. The microstructures revealed by our SEM images of these n-type Si cell contacts are consistent with our previously proposed conduction model using nano-Ag colloids-assisted tunneling [14]- [16].…”
Section: Resultssupporting
confidence: 88%
“…For the realization of highly efficient n‐type silicon solar cells, the front boron emitter presents several challenges. First, metallization for achieving low contact resistivity for the boron emitter is difficult because the conventional Ag paste cannot be used, and Ag‐Al paste induces high recombination current density for the boron emitter contact . Fraunhofer ISE also used the Ti/Pd/Ag evaporation method employing photolithography for the front contact .…”
Section: Introductionmentioning
confidence: 99%
“…[11][12][13][14] In this paper, we report in detail the microstructure of Ag/Al FS contact of n-type c-Si solar cells with SiN x ARC. The firing temperature(s) required for optimal cell performance was carefully identified.…”
Section: Discussionmentioning
confidence: 99%
“…Several papers have been published concerning the current conduction mechanism of these Ag/Al pastes. Lago 11 and Riegel [12][13][14] reported their microstructural investigation of FS contacts printed with Ag/Al pastes on "model" n-type c-Si cells without SiN x anti-reflective coating (ARC). However, it remained unclear whether their findings are applicable to an actual industrial cell where a SiNx ARC is always present.…”
mentioning
confidence: 99%