Influence of surfactants treatment on silver powder and its thick films

Rane, Sunit; Seth, Tanay; Phatak, Girish; Amalnerkar, Dinesh; Das, B. K.

doi:10.1016/s0167-577x(03)00003-x

Cited by 86 publications

(47 citation statements)

References 7 publications

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“…The latter typically is combined with firing which burns away some of the organics. [25][26][27][28] Experimental data on a pre-sintering tapped/compressed density for nanoparticles 25 suggest that an assumption of inter-particle gaps of order 3 to 5 atomic layers is more realistic than direct contact, largely due to the presence of the stabilizing organics.…”

Section: The Initial Configurationmentioning

confidence: 99%

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Nonequilibrium kinetic modeling of sintering of a layer of dispersed nanocrystals

2014

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We report a kinetic Monte Carlo modeling study of nanocrystal layer sintering. Features that are of interest for the dynamics of the layer as a whole, especially the morphology of the evolving structure, are considered. It is found that the kinetics of sintering is not entirely a local process, with the layer morphology affected by the kinetics in a larger than few-particle neighborhood. Consideration of a single layer of particles makes the numerics manageable and allows visualization of the results, as well as numerical simulations of several realizations for statistical averaging of properties of interest. We identify optimal regimes for sintering, considering several particle size distributions and temperature control protocols.

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Section: The Initial Configurationmentioning

confidence: 99%

“…Sintering involves nonequilibrium dynamics 21,23,[25][26][27][28][29][30][31][32][33][34][35] of kinetic processes of transport of matter: atoms, ions or molecules, to be termed "atoms" for brevity. These processes include onsurface restructuring, and detachment/reattachment.…”

Section: Introductionmentioning

confidence: 99%

Nonequilibrium kinetic modeling of sintering of a layer of dispersed nanocrystals

2014

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“…During the sintering process, annealing the nano-particles dramatically increased the density and the electrical conductivity of the sintered silver. Rane et al 16 investigated the effects of particle size, surfactant, thinner, and binder on the microstructure using SEM images and the resistance of sintered silver as indexes. This study revealed that the average size of particles and the type of surfactant treatment influenced the screen printability (rheology) and sintered microstructure.…”

Section: Introductionmentioning

confidence: 99%

Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection

Wang

Chen

Lü

et al. 2007

Journal of Elec Materi

301

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Traditional materials used in chip-level interconnections are not compatible with the high-temperature operation of wide-bandgap high-power semiconductor devices; therefore, this paper studies sintered nano-silver as a novel interconnect material mounting semiconductor devices onto metallized substrates. A low-temperature sintering process was employed in the preparation of a sintered nano-silver die-attachment. The physical mechanisms in volatilization and burnout of the added organic components employed in nanosilver paste were analyzed primarily by thermal gravimetric analysis (TGA) to obtain a reasonable temperature-controlling profile. The shear strength of sintered nano-silver joints was investigated, and the evolution of microstructure in the nano-silver paste sintering process was observed using a scanning electron microscope (SEM) in this process. The effects of sintering temperature, heating rate, and holding time during the sintering process were analyzed according to the densification mechanism. The microstructural observations and shear strength tests showed that a sintering temperature of 285°C, heating rate of 10°C/min, and holding time of 60 min were the best conditions for using this kind of silver paste.

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“…Different formulations of the paste are used to produce conductors that basically consists of several major ingredients; (1) the metal powders, which provide the conductive phase; (2) glasses or oxides, which act as a permanent binder and also promote sintering of metal powders during firing and enable binding of the functional film to the substrate; (3) organic vehicle, which disperse the functional and binder components to impart the desired rheological properties to the paste; and (4) a solvent or thinner that establishes the viscosity of the vehicle phase (Taylor et al, 1981;Lin and Wang, 1996;Rane et al, 2004;Sergent, 2007). Such pastes are screen printed in the desired pattern on the substrate, dried and fired at a certain temperatures to form a conducting thick-film with a thickness ranging from 3 to 30 µm (Rane et al, 2003).…”

mentioning

confidence: 99%

Rheological Behaviors and Their Correlation with Printing Performance of Silver Paste for LTCC Tape

Alias¹,

Shapee²

2012

Rheology

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Influence of surfactants treatment on silver powder and its thick films

Cited by 86 publications

References 7 publications

Nonequilibrium kinetic modeling of sintering of a layer of dispersed nanocrystals

Nonequilibrium kinetic modeling of sintering of a layer of dispersed nanocrystals

Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection

Rheological Behaviors and Their Correlation with Printing Performance of Silver Paste for LTCC Tape

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